- Johns Hopkins University (Gaithersburg, MD)
- …using microscopy, spectroscopy, or scattering based techniques, accelerated laboratory testing and thin film characterization. If selected, you will play a ... significant role in the projects related to reliability testing and modeling for advanced packaging in semiconductors. This includes working with NIST staff and external partners on planning and executing experimental research to evaluate changes in… more
- Johns Hopkins University (Gaithersburg, MD)
- …will include but are not limited to: - Developing new test methods for thin film interfacial adhesion. - Characterizing the degradation of materials and ... interfaces before, during, and after exposure to accelerated laboratory aging. - Conducting in-situ environmental digital image correlation (DIC) to quantify package and assembly deformation during thermal cycling - Developing FIB/TEM/SEM analytical methods… more