- Texas Instruments (Santa Clara, CA)
- …+ Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes + Knowledge of magnetics and high power density enterprise power ... modules (6V - 48V) is a plus + Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates, etc.) + Good understanding of industry & subcon HV packaging capabilities & roadmaps + Overview of high voltage discrete and power modules… more