• Principal IC Packaging Engineer, Silicon…

    SpaceX (Bastrop, TX)
    …packaging assembly processes including material characterization and down-selection for wafer -level and chip-level systems + Develop new technologies and establish ... baselines for assembly and packaging including SMT, flip chip, bonding, molding, underfill, dispense, EMI shielding, lid, and solder ball attach + Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines +… more
    SpaceX (07/15/25)
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  • Mechanical Assembler - 2nd shift

    US Tech Solutions (Mckinney, TX)
    …This position is part of the Thick Films/Lids Group involved in wafer fabrication and related processing activities. The selected candidate will be responsible ... for manual tasks, operating semi and automated processing equipment, and performing rework. The role will include using microscopes, adhering to detailed written work instructions, and documenting non-conformances in our Factory Operating System (FOS). **Key… more
    US Tech Solutions (07/08/25)
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  • Resolution Enhancement Techniques (RET) Process…

    Texas Instruments (Dallas, TX)
    …for next node analog nodes through photolithographic simulation and on mask/ wafer verification. + Data collection, simulation, calibration, and validation of optical ... proximity correction (OPC) models and recipes. + Partnering with internal/external fabs to transfer processes for advanced analog nodes. + Troubleshooting photolithographic patterning/alignment related issues for all fabs within TI. The person performing this… more
    Texas Instruments (07/03/25)
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  • DFM Engineer

    Texas Instruments (Dallas, TX)
    …to co-optimize layout structures for printability + Analyze lithography process data and wafer yield data to identify root causes of patterning defects and implement ... corrective actions. + Evaluate and qualify new OPC/DFM software tools and methodologies. + Develop and maintain automation scripts for OPC/DFM flows. + Stay abreast of industry trends and advancements in lithography, OPC, and DFM. + Document best practices,… more
    Texas Instruments (07/03/25)
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