• Process Technician

    Applied Materials (Albany, NY)
    …with engineers, understand their detailed requirements, and communicate on results; - Monitor wafer in process (WIP) and maintain throughput. - Perform routine ... set up tool status for experiments per instructions. Uses quantitative wafer evaluation and process instrumentation knowledge. **Additional Information** **Time… more
    Applied Materials (07/09/25)
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  • Photonics Integration Engineer

    NY CREATES (Albany, NY)
    … Integration experience; sustaining and/or developing processes in a 300mm wafer fabrication facility. + Process Integration experience non-CMOS technologies ... for Photonics Integration Engineer This posting is to hire an experienced Process Integration Engineer working on our Silicon Photonics technology platforms. This… more
    NY CREATES (07/19/25)
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  • MTS Silicon Photonics Product Packaging Materials

    Global Foundries (Malta, NY)
    …Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. Responsibilities: + Defines process integration materials specifications ... + Drives discipline and qualification robustness through a consistent global qualification process + Typically performs one or more of the following in capacity… more
    Global Foundries (07/24/25)
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  • Engineering Manager, Photolithography

    Cree (Marcy, NY)
    …needed Conduct postmortem analysis of > 24-hour tool down, wafer scrap, or wafer scrap near misses Resolve process issues and continuously improve cycle time ... Here's the Gist: This position is responsible for overseeing the Process and Equipment Engineering team supporting the photolithography module. This person will… more
    Cree (06/06/25)
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  • 3D Heterogeneous Integration Senior Manager

    Global Foundries (Malta, NY)
    …leading the 3DHI team to develop various advanced packaging capabilities, such as wafer -to- wafer (W2W) hybrid / fusion bonding, die-to- wafer (D2W) hybrid ... to develop various advanced packaging capabilities , such as wafer -to- wafer (W2W) hybrid / fusion bonding, die-to-...a reasonable accommodation for any part of the employment process , please contact us by email at ###@gf.com and… more
    Global Foundries (05/21/25)
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  • Unit Process Engineer - CMP and Wets

    IBM (Albany, NY)
    …web based statistical process control charts (wSPC), SiView (software to manage wafer movement and tool processing) to collect the wafer history and related ... IBM, you will get to work on the semiconductor process equipment that are driving the quantum revolution and...Nanotech is currently seeking engineers in the area of process technology for semiconductors and related devices, including CMP,… more
    IBM (07/04/25)
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  • Manager of Packaging Assembly Integration

    Global Foundries (Malta, NY)
    …meeting customer requirements. The candidate will bring a strong focus on assembly process interactions for each step in a SiPh Flip Chip package towards delivery ... with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding.… more
    Global Foundries (07/24/25)
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  • SMTS Silicon Photonics Product Engineer

    Global Foundries (Malta, NY)
    …converters and 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding . ... . + Drives discipline and qualification robustness through a consistent global qualification process + Typically performs one or more of the following in capacity of… more
    Global Foundries (07/24/25)
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  • 3D Heterogeneous Integration Design Enablement…

    Global Foundries (Malta, NY)
    …integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer - to - wafer bonding, die - to - wafer ... by the product lines in partnership with the unit process and R&D engineers. + DM is a collection...Advanced packaging liaison to the DM and PDK ( Process D esign K it) teams to translate packaging… more
    Global Foundries (07/23/25)
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  • Fellow - SiPh Packaging & Assembly

    Global Foundries (Malta, NY)
    …compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Drives increased discipline and qualification robustness through a consistent global qualification process + Perform all activities in a safe and responsible manner… more
    Global Foundries (05/07/25)
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