- NY CREATES (Albany, NY)
- … Integration experience; sustaining and/or developing processes in a 300mm wafer fabrication facility. + Process Integration experience non-CMOS technologies ... for Photonics Integration Engineer This posting is to hire an experienced Process Integration Engineer working on our Silicon Photonics technology platforms. This… more
- Global Foundries (Malta, NY)
- …Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. Responsibilities: + Defines process integration materials specifications ... + Drives discipline and qualification robustness through a consistent global qualification process + Typically performs one or more of the following in capacity… more
- Global Foundries (Malta, NY)
- …integration (3DHI) development including wafer -to- wafer and die-to- wafer bonding. Essential Responsibilities: + Lead 3DHI process development ... efforts and planning by working with the unit process engineers and directly with the tools & materials...with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous… more
- Cree (Marcy, NY)
- …needed Conduct postmortem analysis of > 24-hour tool down, wafer scrap, or wafer scrap near misses Resolve process issues and continuously improve cycle time ... Here's the Gist: This position is responsible for overseeing the Process and Equipment Engineering team supporting the photolithography module. This person will… more
- IBM (Albany, NY)
- …web based statistical process control charts (wSPC), SiView (software to manage wafer movement and tool processing) to collect the wafer history and related ... IBM, you will get to work on the semiconductor process equipment that are driving the quantum revolution and...Nanotech is currently seeking engineers in the area of process technology for semiconductors and related devices, including CMP,… more
- Global Foundries (Malta, NY)
- …meeting customer requirements. The candidate will bring a strong focus on assembly process interactions for each step in a SiPh Flip Chip package towards delivery ... with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding.… more
- Global Foundries (Malta, NY)
- …converters and 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding . ... . + Drives discipline and qualification robustness through a consistent global qualification process + Typically performs one or more of the following in capacity of… more
- Global Foundries (Malta, NY)
- …integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer - to - wafer bonding, die - to - wafer ... by the product lines in partnership with the unit process and R&D engineers. + DM is a collection...Advanced packaging liaison to the DM and PDK ( Process D esign K it) teams to translate packaging… more
- Global Foundries (Malta, NY)
- …compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Drives increased discipline and qualification robustness through a consistent global qualification process + Perform all activities in a safe and responsible manner… more
- Global Foundries (Malta, NY)
- …engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes wafer to wafer hybrid bonding, die to wafer hybrid ... and optimizations + Modeling of processes + Assisting engineers in daily integration/ process development tasks Other Responsibilities: + Perform all activities in a… more