• Electronics Package Design Engineer

    MetaOption, LLC (Ronkonkoma, NY)
    Electronics Package Design Engineer Primary Skills - package layout, signal integrity, flip chip, bga, ceramic, multi-chip modules, electronics packaging, system ... in package, cadence Job Description Electronics Packaging Design Engineer We are seeking an experienced...interposers, HBM, fan-out WLP, wire bond, flip chip, stacked die , ceramic co-fire, encapsulated modules/BGAs). * Strong knowledge of… more
    MetaOption, LLC (10/25/25)
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  • Senior RF GaN Power Amplifier Design

    Texas Instruments (Dallas, TX)
    …communities. Put your talent to work with us. The Senior RF GaN Power Amplifier Design Engineer role is within Kilby Labs, the central R&D organization of TI. ... co-simulations + Defining process technology roadmaps **Why TI?** + Engineer your future. We empower our employees to truly...Virtuoso or ADS layout + Strong foundation of electromagnetic design using HFSS or ADS Momentum on die more
    Texas Instruments (12/03/25)
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  • Senior Staff Engineer , Mechanical…

    Celestica (Portland, OR)
    …New Hampshire City: Remote Employee US **Summary** The Senior Staff Engineer , Mechanical Design develops new mechanical systems/modules and maintains ... mechanical system that they have designed. The Senior Staff Engineer , Mechanical Design works with cross functional...Good knowledge in sheet metal tooling, plastic tooling and die casting tooling. + Good knowledge in industrial standards… more
    Celestica (11/01/25)
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  • Principal / Senior Principal Engineer

    Northrop Grumman (Linthicum Heights, MD)
    …(ATL) - located outside of Baltimore, Maryland - is where we design , manufacture, and test semiconductor products for internal and commercial production customers ... **You'll Get To:** Bring your comprehensive understanding of semiconductor die packaging-from wafer preparation through hermetic sealing and final delivery.… more
    Northrop Grumman (11/01/25)
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  • Mechanical Design Engineer

    Actalent (Virginia Beach, VA)
    Overview: Junior Mechanical Engineering position with emphasis on electronics hardware design . This position will work with a lead mechanical engineer as part of ... a cross-functional team of engineers to design and develop high-performance products. The scope of the...with outside vendors to source custom machined, sheet metal, die -cut, and injection molded parts. + Develop and manage… more
    Actalent (12/06/25)
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  • Staff Memory Design Engineer , DRAM

    Micron Technology, Inc. (Boise, ID)
    …DRAM products that meet the demands of modern computing. As a Principal Design Engineer , you will be responsible for designing, simulating, and optimizing ... circuits and optimize for sense margins, array timings, and die size. + Prepare design documentation for...array timings, and die size. + Prepare design documentation for other engineers. **_DRAM Circuit Verification and… more
    Micron Technology, Inc. (11/14/25)
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  • SMTS Design Engineer , NVEG

    Micron Technology, Inc. (San Jose, CA)
    …non-volatile memory products. **Position Overview** The Senior Member of Technical Staff Design Engineer in Micron's NVEG organization contributes to the ... of memory products that are best-in-class in terms of die size, performance, reliability, and power. Our NVEG organization...of new memory products by assisting with the overall design , layout, and optimization of datapath circuits for NAND… more
    Micron Technology, Inc. (10/25/25)
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  • Component Design Release Engineer

    Ford Motor Company (Dearborn, MI)
    …and Thermal Systems Engineering (IPTSE) organization and is for a Component Design /Release Engineer (CPMT Leader). The specific sub-systems of responsibility ... Preferred experience in Front End Accessory Drive systems, Sand cast/ Die Cast metallic and/or Composite injecton molded components, and...vehicle lines. **What you'll do ** The Product Development Engineer will * Design & Release new… more
    Ford Motor Company (12/12/25)
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  • IP Integration Engineer

    Broadcom (Fort Collins, CO)
    …some examples. **The IP Integration Engineer ** will be part of a cross functional design team developing die -to- die and die -to-memory PHY IP. The ... please Sign-In before you apply.** **Job Description:** **IP Integration Engineer ** Broadcom's ASIC Product Division (APD) is focused on...and 3+ years of related experience + Understanding of design trade offs for power, area, and speed in… more
    Broadcom (11/20/25)
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  • Packaging Design Engineer

    Actalent (Maple Grove, MN)
    …equipment needs/constraints, provide suggestions on potential cost savings, and optimize packaging design . + Develop and maintain die lines and inspection plans ... Job Description The Packaging Engineer is responsible for packaging engineering activities with specific areas of responsibility including providing technical… more
    Actalent (12/13/25)
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