- MetaOption, LLC (Ronkonkoma, NY)
- Electronics Package Design Engineer Primary Skills - package layout, signal integrity, flip chip, bga, ceramic, multi-chip modules, electronics packaging, system in ... package, cadence Job Description Electronics Packaging Design Engineer We are seeking an experienced...interposers, HBM, fan-out WLP, wire bond, flip chip, stacked die , ceramic co-fire, encapsulated modules/BGAs). * Strong knowledge of… more
- Ford Motor Company (Dearborn, MI)
- …Thermal Systems Engineering (IPTSE) organization and is for a Component Design /Release Engineer (CPMT Leader). The specific sub-systems of responsibility would be ... Base Engine. Preferred experience in Front End Accessory Drive systems, Sand cast/ Die Cast metallic and/or Composite injecton molded components, and static / dynamic… more
- Acuity Inc. (Decatur, GA)
- …business segments, Acuity Brands Lighting (ABL) and Acuity Intelligent Spaces (AIS), we design , manufacture, and bring to market products and services that make a ... on decades of lighting expertise, Nightingale solutions combine the best design and illumination engineering to provide a patient-centric experience emphasizing… more
- Micron Technology, Inc. (Boise, ID)
- …leadership in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices like ... GDDR packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical requirements of the future. Finite element… more
- Cadence Design Systems, Inc. (San Jose, CA)
- …complex IC packaging of electronics using highly integrated IC package co- design and multi- die chiplet methodologies. Responsibilities include: + Working ... on the world of technology. Application Engineer Architect for Allegro Package Design Tools - San Jose, CA Cadence offers amazing opportunities for professional… more
- Broadcom (Fort Collins, CO)
- …as some examples. **The IP Integration Engineer** will be part of a cross functional design team developing die -to- die and die -to-memory PHY IP. The ... and 3+ years of related experience + Understanding of design trade offs for power, area, and speed in...Duties Include:** + Develop a detailed understanding of Broadcom's die -to- die PHYs. + Work with multiple cross… more
- NVIDIA (Santa Clara, CA)
- …next wave of computing. We are now looking for a motivated Senior Circuit Design Engineer in Power Modeling and Simulation to join our dynamic and growing Circuits ... What you'll be doing: + Participate in innovative Processor design in deep submicron technologies. + Work as part...+ Model and simulate power delivery networks (PDN) from die level all the way to platform level. +… more
- Aluminum Precision Products, Inc. (Oxnard, CA)
- …CNC machining and be able to visualize the result. + Welding knowledge required. + Die design , Mold design or tool shop experience is needed. Compensation: ... + Robust training program Job Summary: We are looking for a Manufacturing / Design Engineer that can start working right away. In this position you will develop,… more
- Northrop Grumman (Linthicum Heights, MD)
- …(ATL) - located outside of Baltimore, Maryland - is where we design , manufacture, and test semiconductor products for internal and commercial production customers ... **You'll Get To:** Bring your comprehensive understanding of semiconductor die packaging-from wafer preparation through hermetic sealing and final delivery.… more
- MACOM Technology Solutions Holdings (Lowell, MA)
- …Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. ... standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and… more