- Texas Instruments (Dallas, TX)
- …interconnects (ie CuPillars, solder bumps), study of de-embedding and correlation with simulation results * Development of a thermal model for high power advanced ... a mechanical model for advanced package structures using FEM solvers **Why TI?** + Engineer your future. We empower our employees to truly own their career and… more
- Actalent (Seattle, WA)
- …payloads and phased-array antenna modules. + Collaborate with the Responsible Engineer to define and maintain board-level architecture, layer stack-ups, and routing ... for high-reliability boards. What You'll Bring: + Associate's or Bachelor's in Electrical /Computer Engineering or equivalent experience + Expert in PCB layout and… more