• Program Engineering Manager Space Systems,…

    BAE Systems (Manassas, VA)
    …or production experience + Understanding of radiation hardness in digital electronics design applications, requirements, analysis, and architecture + Experience ... Communications domains + Detailed understanding of high reliability and radiation hardened electronics design , analysis, and testing + Understanding of parts… more
    BAE Systems (09/30/25)
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  • Layout Designer

    Texas Instruments (Phoenix, AZ)
    …with some of the smartest people in the world to shape the future of electronics . + We're different by design . Diverse backgrounds and perspectives are what push ... drawings of semiconductor devices from schematics and related geometry provided by design engineering. **About the job** This position will require the creation and… more
    Texas Instruments (11/08/25)
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  • Facilities Engineering Intern

    Texas Instruments (Richardson, TX)
    …Conducting feasibility studies and testing on new and modified designs + Providing design information to drafting for packaging documentation + Planning plant, ... or work authorization for this position. **Why TI?** + Engineer your future. We empower our employees to truly...people in the world to shape the future of electronics . + We're different by design . Diverse… more
    Texas Instruments (12/02/25)
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  • Stress Analyst

    Curtiss-Wright Corporation (Cheswick, PA)
    …detailed design , design testing and prototype fabrication. Provides design information to drafting for packaging documentation. **Salary: $59,700 to ... to join our Pittsburgh (Cheswick) location. As our **Stress Analyst,** you will design and analyze a variety of mechanical systems, equipment and packaging .… more
    Curtiss-Wright Corporation (11/05/25)
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  • Process Development Engineering Manager

    Texas Instruments (Lehi, UT)
    …with some of the smartest people in the world to shape the future of electronics . + We're different by design . Diverse backgrounds and perspectives are what push ... working closely with the unit process development group to design experiments to evaluate multiple integration options and arrive...to ensure silicon process is compatible with test and packaging robustness requirements. As part of this role, you… more
    Texas Instruments (11/25/25)
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  • Research Engineering Specialist

    Eaton Corporation (Arden, NC)
    …Relocation assistance will be provided, if needed. The Medium Voltaage Power Electronics team has the principal goal of identifying, developing, and justifying ... for the MV Controls business in the area of power electronics , power converters, power systems, electric drives, electromagnetics, numerical modeling and… more
    Eaton Corporation (12/03/25)
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  • Principal/ Sr. Principal Aeronautical Eng.-Product…

    Northrop Grumman (Los Angeles, CA)
    …in a Scrum, Agile, or Kanban product-development environment + Experience in creating electronics packaging + Experience design for manufacturability + ... CA** . is currently seeking a **Principal/Sr. Principal Aeronautical Engineer /Product Owner.** We are excited for you to join...**Job Responsibilities:** + Responsible for leading the SiAW Airframe Design Team as the Product Owner. + Design more
    Northrop Grumman (10/15/25)
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  • Advanced Device Modeling Expert - TCAD

    Applied Materials (Santa Clara, CA)
    …produce virtually every new chip and advanced display in the world. We design , build and service cutting-edge equipment that helps our customers manufacture display ... use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally...You can be part of this cutting-edge modeling and design team, where you will have the opportunity to… more
    Applied Materials (10/21/25)
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  • Sr Lidar DRE

    General Motors (Warren, MI)
    **Job Description** **The Role:** We are looking for an expert Sr Design Release Engineer - Lidar to join our team and help us build the best automated vehicles ... Provides technical leadership for advanced technology development and can perform complex design and packaging analysis + Develops engineering designs (including… more
    General Motors (11/19/25)
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  • Postdoctoral Fellow (PREP0003909) - #Faculty

    Johns Hopkins University (Gaithersburg, MD)
    …the scientific research of the collaboration. Research Title: Research Engineer (CHIPS Project: Nondestructive defect detection metrology for advanced semiconductor ... packaging ) The work will entail: The candidate will join...responsibilities will include, but are not limited to: ? Design 3D models for simulation, run XCT simulations, carry… more
    Johns Hopkins University (11/15/25)
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