- University of Rochester (Rochester, NY)
- …the blood-brain barrier; (2) Conducting computational simulations of new MPS using finite - element models (ie COMSOL); (3) testing neuroinflammatory properties of ... residents in the Department of Dermatology. The successful candidate must have a PhD degree in Biomedical Engineering or a related field and will be responsible… more
- Precise Systems, Inc. (Washington, DC)
- …in materials research, environmental effects, and engineering projects + Experience with finite element analysis (FEA) modeling + Experience with MATLAB for ... data acquisition, analysis and presentation + Sound knowledge and understanding of physical and mechanical properties and behavior of structural polymers, composites, and adhesives + Understanding of polymer formulations in order to develop approaches to… more
- Holtec International (Camden, NJ)
- …licensing requirements and documentation for nuclear SSCs TYPICAL ANALYSES + Static and dynamic finite element analyses (FEA) using ANSYS + Drop and impact (eg, ... missile and aircraft) analyses and target response using LS-DYNA + Simulation of the seismic response of freestanding structures in air or submerged in water + Static and dynamic analyses of large reinforced concrete or steel-concrete composite structures +… more
- General Atomics (San Diego, CA)
- …modeling approaches, with knowledge in ceramics or composites desirable. + Experience in finite element analysis using ANSYS, ABAQUS, or similar programs. + ... + Typically requires a bachelors degree, masters degree or PhD in engineering or a related technical discipline from...masters degree, or two or more years with a PhD . May substitute equivalent engineering experience in lieu of… more
- General Atomics (San Diego, CA)
- …tools (eg, LTSPICE or related), data analysis tools (eg, MATLAB, Python), finite element analysis, and diagnostics programming languages (eg, C/C++, C#) ... + Typically requires a bachelor's degree, master's degree or PhD in engineering or a related technical discipline from...degree, or two (2) or more years with a PhD . May substitute equivalent engineering experience in lieu of… more
- General Atomics (Poway, CA)
- …analysis, or modeling of RF or EO/IR sensors + Full wave solver analysis (ie, Finite Element Method) for RF or RCS + System, Subsystem Integration Laboratory ... + Typically requires a bachelors degree, masters degree or PhD in engineering or a related technical discipline from...masters degree, or ten or more years with a PhD . May substitute equivalent engineering experience in lieu of… more
- General Atomics (Englewood, CO)
- …testing, and failure analysis, is preferred. + Proficiency in CAD and FEA ( finite element analysis) software such as SolidWorks, ANSYS, NASTRAN, FEMAP, Thermal ... + Typically requires a bachelors degree, masters degree or PhD in engineering or a related technical discipline from...masters degree, or seven or more years with a PhD . May substitute equivalent engineering experience in lieu of… more
- Bridgestone Americas (Akron, OH)
- …physical NVH methods and techniques. + Proficiency in computational methods, including Finite Element Analysis (FEA). + Proficiency in scripting languages such ... topics, and serve as a mentor. **Preferred Qualifications:** + PhD in Acoustics, Vibrations or structural dynamics. + Demonstrated...or 3 years and a master's degree; or a PhD without experience; or equivalent work experience **At Bridgestone,… more
- UL, LLC (Northbrook, IL)
- …dynamics and robust knowledge of state-of-the-art computational fluid dynamics software and finite element analysis software are required. A successful candidate ... fluid dynamics or other relevant disciplines is required. MS or PhD preferred. + MS or PhD requires 4 years of relevant work experience. BS requires 8… more
- Applied Materials (Santa Clara, CA)
- …reliability, and manufacturing. **Key Responsibilities** + Develop and validate detailed finite element analysis (FEA) models to simulate thermal and ... mechanical behavior of advanced semiconductor packages. + Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures (eg, flip-chip, fan-out, 2.5D/3D IC,… more