• Global Quality IC Package

    Micron Technology, Inc. (Boise, ID)
    …and continuous improvement. **Position Overview:** As a GQ Package Design /Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron Technology ... be responsible for the quality and reliability of new IC package technology introductions. This role focuses...related field. + 7+ years of experience in semiconductor package design , manufacturing, or Quality & Reliability… more
    Micron Technology, Inc. (12/18/25)
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  • IC Packaging Test Engineer

    SpaceX (Bastrop, TX)
    IC Packaging Test Engineer , Silicon...reliable internet to those that need it most. We design , build, and launch the world's largest and most advanced ... the ultimate goal of enabling human life on Mars. IC PACKAGING TEST ENGINEER , SILICON...internet to even the most remote locations. We also design , build, and ship the hardware that sits in… more
    SpaceX (10/30/25)
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  • Sr. IC Packaging Test…

    SpaceX (Bastrop, TX)
    Sr. IC Packaging Test Engineer ,...fast, reliable internet to millions of users worldwide. We design , build, test, and operate all parts of the ... ultimate goal of enabling human life on Mars. SR. IC PACKAGING TEST ENGINEER , SILICON...signal testing + Wafer sort, wafer probe, probe card design , and test experience + Custom socket and wafer… more
    SpaceX (01/01/26)
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  • IC Package Engineer

    SpaceX (Bastrop, TX)
    IC Package Engineer (Starlink/Akoustis) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out exploring the stars is ... the ultimate goal of enabling human life on Mars. IC PACKAGE ENGINEER (STARLINK/AKOUSTIS) Akoustis...for technical innovation and attention to detail. RESPONSIBILITIES: + Design , develop, and qualify IC packaging more
    SpaceX (01/01/26)
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  • Sr Advanced IC CAD Engineer

    Honeywell (Phoenix, AZ)
    …and engagement, and fostering an inclusive culture. **KEY RESPONSIBILITIES** + Work with IC Design EDA Applications, High Performance Compute cluster staff, and ... IC Design engineers to craft and maintain...fields, Honeywell employees are eligible for a comprehensive benefits package . This package includes employer subsidized Medical,… more
    Honeywell (11/14/25)
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  • IC / Semiconductor Package Designer

    Broadcom (Irvine, CA)
    Package Designer** **Role Overview** We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design , ... etc.) to drive signal integrity optimization. ** Package Design & Integration** + Work with IC ...or related field. + Extensive hands-on experience in advanced IC packaging for advanced silicon nodes. +… more
    Broadcom (12/02/25)
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  • IC Package Mechanical FEA…

    Broadcom (Fort Collins, CO)
    …Sign-In before you apply.** **Job Description:** Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for ... be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking,...the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs… more
    Broadcom (12/02/25)
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  • Principal Engineer (Director IC

    Fannie Mae (Reston, VA)
    …hardware, technology, and/or processes. *THE IMPACT YOU WILL MAKE* The *Principal Engineer (Director IC ), Exchange Platform (APIs, Files, AI protocols, and ... or products while identifying and resolving conflicting and/or complementary needs. * Design and develop technical solutions, which include leading matrixed teams. *… more
    Fannie Mae (10/17/25)
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  • IC Power, IR and EM Sr. Application…

    Cadence Design Systems, Inc. (San Jose, CA)
    …chip planning to IR/EM sign-off. + Fundamental understanding of interconnect modeling, package analysis, and die modeling. + Ability to write and debug automation ... technologies that modern life depends on. We are a global electronic design automation company, providing software, hardware, and intellectual property to design more
    Cadence Design Systems, Inc. (11/15/25)
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  • Principal Design Engineer , TSV…

    Micron Technology, Inc. (Boise, ID)
    …in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices like ... to meet the mechanical requirements of the future. Finite element analysis of package design enables innovation and development of outstanding solutions to help… more
    Micron Technology, Inc. (12/10/25)
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