• Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …Compound Semiconductor Laboratory (CSL): Facilities housing III-V and non-silicon material growth ( molecular beam epitaxy (MBE), metalorganic chemical vapor ... deposition (MOCVD), diamond chemical vapor deposition (CVD)) and fabrication * Microsystems Integration Facility (MIF): Packaging and integration facilities for wire-bonding, vacuum-reflow soldering, flip-chip hybrid integration Job Description The candidate… more
    MIT Lincoln Laboratory (08/08/25)
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  • Part Time Non-Exempt Assistant Research Scientist…

    New York University (New York, NY)
    The project will focus on characterizing the quality of semiconductor heterostructures grown by molecular beam epitaxy and analyzing the collected data using ... machine learning tools. The individual must seek to foster a safe and efficient laboratory work environment. This project involves collaboration with theoretical and experimental groups within and outside of NYU. Teamwork, strong communication skills, and an… more
    New York University (08/07/25)
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  • Integrated Circuit (IC) Layout and Mask Design…

    MIT Lincoln Laboratory (Lexington, MA)
    …Compound Semiconductor Laboratory (CSL): Facilities housing III-V and non-silicon material growth ( molecular beam epitaxy (MBE), metalorganic chemical vapor ... deposition (MOCVD), diamond chemical vapor deposition (CVD)) and fabrication * Microsystems Integration Facility (MIF): Packaging and integration facilities for wire-bonding, vacuum-reflow soldering, flip-chip hybrid integration Job Description The candidate… more
    MIT Lincoln Laboratory (05/29/25)
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