• Principal Systems Design

    Micron Technology, Inc. (Folsom, CA)
    …in Folsom, California is seeking a highly experienced **Custom Layout and High-Speed I/O Design Engineer ** to help shape the future of memory solutions for AI ... HBM product family. **Responsibilities** + Own full-chip floorplanning, design partitioning, and top-level synthesis with multiple hard macro IP blocks.… more
    Micron Technology, Inc. (11/20/25)
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  • Principal IO Design Architect,…

    Micron Technology, Inc. (Richardson, TX)
    …bit solutions in the industry! **Position Overview:** We are searching for a Principal HBM IO Architecture Design engineer own the development of the PHY ... will include, but are not limited to:** + IO and datapath design architect for HBM products + Design low-power high-speed Tx, Rx, clock tree… more
    Micron Technology, Inc. (10/31/25)
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  • Principal Design Engineer

    Micron Technology, Inc. (Boise, ID)
    …Micron's leadership in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory ... devices like HBM , RDIMM/LRDIMM and CAMM modules, graphics GDDR packages and...and other Micron architectures require extensive engineering analysis and design to meet the mechanical requirements of the future.… more
    Micron Technology, Inc. (12/10/25)
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  • Principal Design Engineer

    Micron Technology, Inc. (Richardson, TX)
    …advance faster than ever. Micron is seeking a highly motivated and experienced ASIC Design Engineer to define and drive the architecture of next-generation ASICs ... + Architect and model data path, control path, cache design , and IO interface logic for high-speed memory access...correction coding (ECC). + Knowledge of chiplet architectures and HBM integration + Strong communication and leadership skills with… more
    Micron Technology, Inc. (10/25/25)
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  • Principal Thermal Simulation…

    Micron Technology, Inc. (Boise, ID)
    …Micron's leadership in the industry. **Position Overview:** The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced ... memory ( HBM ) packaging technologies, driving Micron's Thermal advantage by designing...power maps, die and package architecture, and Si BEOL design rules, finding efficient package structure and materials to… more
    Micron Technology, Inc. (12/10/25)
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  • Sr Principal Product Engineer

    Cadence Design Systems, Inc. (San Jose, CA)
    …the world of technology. About Us Cadence is a pivotal leader in electronic design , building upon more than 30 years of computational software expertise. We apply ... our Intelligent System Design strategy to deliver software, hardware, and IP that...IP related to memory protocols such as DDR, LPDDR, HBM , and GDDR, and to engage with top technology… more
    Cadence Design Systems, Inc. (11/22/25)
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