• Principal Software Engineer…

    Microsoft Corporation (Santa Clara, CA)
    …help achieve that mission. The DPU team, within the Azure Hardware Systems & Infrastructure group, brings together state-of-the-art software and hardware expertise ... to create a highly programmable and high-performance chip with the capability to efficiently handle large data...CPU-based alternatives. As a Software Engineer in the DPU Integration and Test team, you will be involved in… more
    Microsoft Corporation (08/08/25)
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  • Principal IC Packaging Engineer, Silicon…

    SpaceX (Bastrop, TX)
    …assembly processes including material characterization and down-selection for wafer-level and chip -level systems + Develop new technologies and establish ... development + Familiarity with 2D, 2.5D, and/or 3D packaging integration + Packaging familiarity with flip- chip , BGA,...chip , BGA, fcCSP, WLCSP, fan out FO processes, system -in-package SiP, multi- chip modules MCM, wirebond, panel… more
    SpaceX (07/15/25)
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  • Principal Sr Engineer - FPGA Design - $15K…

    BAE Systems (Westminster, CO)
    …of concept, and production programs. + FPGA development and digital IP integration for tactical RF, high reliability electronic systems . Assignments include ... advanced function implementation in FPGAs. + Solid electronic circuit design and electronic systems background. + Expertise in VHDL/Verilog and System Verilog. +… more
    BAE Systems (08/01/25)
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  • Sr. Principal Microelectronic Semiconductor…

    Northrop Grumman (Apopka, FL)
    Systems is seeking an experienced and motivated_ **_Senior Principal Microelectronics Semiconductor Photolithography Process Engineer_** _for our Advanced ... Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations… more
    Northrop Grumman (07/16/25)
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  • Principal Digital Engineer/Senior…

    Northrop Grumman (Linthicum Heights, MD)
    …Board Computers, Multi- chip Modules, SiPs, SoCs, ASICs, and FPGAs. Perform integration and test for subsystems and modules. + Design and model specific aspects ... EO/IR Sensors, Sonar and Acoustic Sensors, AI & ML, Multi- chip Modules, System in a Package, Hardware...process, CI/CD design flow. + Experience with board or system level integration , test and debug using… more
    Northrop Grumman (07/02/25)
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  • Sr. Principal ASIC/Analog Design Engineer

    Teledyne (Goleta, CA)
    …group is involved in early system trades as well as support for camera integration and production. You will be tasked take the lead in the design and analysis of ... volume cell phone and automotive cameras to high-end performance systems for security and search and track applications. This...and implementation of a large portion of the overall chip . While completing system level trades as… more
    Teledyne (07/03/25)
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  • Sr. Principal RF Module Design Engineer

    Skyworks (Cedar Rapids, IA)
    …performance. * Lead efforts in the simulation and EM analysis of filters, multi- chip modules (MCM), and integrated systems using Agilent ADS/Cadence and 2.5/3D ... Sr. Principal RF Module Design Engineer Apply now "...communication devices, taking part in the design, simulation, and integration of PA, RF switches, front-end modules, and acoustic… more
    Skyworks (07/08/25)
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  • Principal Platform Architect, Agentic AI

    NVIDIA (Santa Clara, CA)
    …by great technology-and amazing people. As part of Nvidia's applied AI team for chip design, you will have the opportunity to tap into the unlimited potential of ... AI and change the landscape of the chip industry. Our team operates at the intersection of...massively by performance tuning and optimizing complex, globally distributed systems + Familiarity with modern software development stacks and… more
    NVIDIA (07/01/25)
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  • Principal Design Engineer

    Microsoft Corporation (Mountain View, CA)
    …** Principal Design Engineer** to work in the dynamic Microsoft Artificial Intelligence System on Chip (AISoC) Silicon team. The candidate must be a highly ... + System software/firmware/hardware interactions and optimization + Experience in Sub- system and SoC integration Silicon Engineering IC5 - The typical… more
    Microsoft Corporation (07/25/25)
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  • Software/ Principal Software Engineer

    Northrop Grumman (Rolling Meadows, IL)
    … that utilize Parallel Processing, Multi-Threading, Distributed Processing, Multi-Core, System -on- Chip , and Secure Processing. + Active Secret Clearance ... our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today,...be a part of our mission! As a Software Engineer/ Principal Software Engineer at Northrop Grumman you will have… more
    Northrop Grumman (06/18/25)
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