• Module Process Equipment Engineer

    Meta (Sunnyvale, CA)
    …data solutions to support transparent display systems. **Required Skills:** Module Process Equipment Engineer Responsibilities: 1. Lead module equipment ... - Ensure the product design is compatible with the process equipment and the equipment and process ... assembly equipment integration in precision or Optical Assembly for consumer electronics 11. Track-record of… more
    Meta (08/01/25)
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  • Senior Mfg. & Process Engineer

    Capgemini (Kinston, NC)
    …activities * Evaluate and propose key indicators in order to measure the assembly process productivity and performance measures. * Identify and propose ... **Job:** _Developer_ **Organization:** _ERD PPL US_ **Title:** _Senior Mfg. & Process Engineer - Industrial Engineer_ **Location:** _NC-Kinston_ **Requisition… more
    Capgemini (07/10/25)
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  • NPI Process Engineer

    Insight Global (Hialeah, FL)
    Job Description Insight Global is looking for a Manufacturing Process Engineer to develop process technologies and acquire, develop, and qualify ... electronics manufacturing, mechanical engineering, mechanical design, manufacturing, and process engineering, specifically with RF and Microwave electronic components… more
    Insight Global (07/24/25)
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  • Sr. Lead DFA/DFM Process Engineer

    Celestica (Richardson, TX)
    …State/Province: Texas City: Richardson **General Overview** **Summary** The Senior Lead Engineer , Manufacturing Process will work closely with cross-functional ... work instructions, serving as foundational documentation for efficient and standardized assembly procedures, enabling early training and process refinement. +… more
    Celestica (06/27/25)
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  • Mfg. & Process Engineer

    Capgemini (Kinston, NC)
    …**Job:** _Programmer/Analyst_ **Organization:** _ERD PPL US_ **Title:** _Mfg. & Process Engineer - Manufacturing engineering_ **Location:** _NC-Kinston_ ... stakeholders. * Identify, assess, and mitigate risks impacting the manufacturing process . * Ensure proper configuration control of products and manage changes… more
    Capgemini (07/25/25)
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  • Wafer/FPA Fab/ Process Engineer

    Teledyne (Montgomeryville, PA)
    …being on a team that wins. **Job Description** **Position Summary:** Semiconductor wafer fab/ process engineer for advanced IR detectors and focal plane arrays ... (FPAs) fab process development and production, from junior to mid-level engineer , in a high growth, high technology, high reward, and highly motivated… more
    Teledyne (05/24/25)
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  • Prototype Build Engineer - Electrical

    Meta (Redmond, WA)
    …looking for an experienced electrical engineer who has successfully led electronics projects through the development process , drawing on their technical ... Electrical Responsibilities: 1. Translating a design (schematics, CAD, functional requirements) into an assembly process flow 2. Partner with EE, PD and SW… more
    Meta (08/08/25)
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  • Lead/Senior Process Engineer

    The Boeing Company (Huntsville, AL)
    …with us. Boeing Defense & Space (BDS) is hiring a **Lead or Senior** ** Process Engineer ** to join the **Patriot Advanced Capability 3 (PAC-3)** team located ... also have a proven track record of successfully leading process improvement initiatives and driving positive change within a...8+ years of technical leadership and experience in the Electronics Manufacturing / PCB Assembly industry +… more
    The Boeing Company (08/08/25)
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  • Staff Microelectronics Process

    Northrop Grumman (Linthicum Heights, MD)
    …of semiconductor technology including design, mask making, wafer fabrication, test, and assembly . The Staff Microelectronics Process Engineer will work ... Mission Systems is seeking an exceptionally talented and motivated **Staff Microelectronics Process Engineer ** to join our Workforce Development Team. Advanced… more
    Northrop Grumman (07/31/25)
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  • Packaging Engineer

    Texas Instruments (Dallas, TX)
    …Industrial, Aerospace & Defense, Mobile and Enterprise applications + Define FCCSP assembly and bump process requirements based on customer requirements and ... requirements for Flip Chip CSP (FCCSP) packaging and bump process development and maintain quality of existing packages for...studies + Act as a liaison with OSATs (outsourced assembly test sites), internal assembly sites and… more
    Texas Instruments (07/19/25)
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