- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... division and company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be… more
- Teradyne (North Reading, MA)
- …Overview The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne. We have a dual charter to technically support the ... division and company: + Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be… more
- Micron Technology, Inc. (Richardson, TX)
- …HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Design Engineer in sustaining role you will ... teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on evaluating silicon issues seen on… more
- Micron Technology, Inc. (Richardson, TX)
- …The HBM product family is growing due to high demand from industry leading semiconductor companies! As an HBM Memory Design Engineer in sustaining role you will be ... teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on evaluating silicon issues seen on… more
- Micron Technology, Inc. (Boise, ID)
- …experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience. ... supporting the growth of our DRAM, HBM, and Advanced Packaging functions. **What You'll Do** As a Workforce Development...As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more
- Micron Technology, Inc. (Boise, ID)
- …memory architectures, system memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging , and 3D ... benefits, discretionary bonuses and equity. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.… more
- Renesas (San Jose, CA)
- …**Collaboration with Cross-functional Teams** : Work closely with design, product, test, packaging and other teams to ensure DDR5 solutions meet all performance and ... to learn more about our many benefits and resources Renesas is an embedded semiconductor solution provider driven by its Purpose ' **To Make Our Lives Easier** .'… more
- Micron Technology, Inc. (Boise, ID)
- …opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3-5 year outlook, and to ... and organizations including Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration. Qualifications Successful candidates for this… more
- Micron Technology, Inc. (Boise, ID)
- …areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of future ... improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal integrity… more
- Advanced Energy (Eden Prairie, MN)
- …complex applications for a wide range of industries including semiconductor equipment, industrial, manufacturing, telecommunications, data center computing and ... the RFQ + Guide responsible engineers to work on the electrical and mechanical packaging approach for cost breakdown + Lead in drafting the technical proposal and… more
