• Open Rank Faculty Positions in Electrical…

    The University Of Texas At Dallas (Dallas, TX)
    …computation. In addition, we are interested in research areas related to semiconductor devices, including semiconductor manufacturing, packaging , and ... may be considered. Research in ECE is divided into five broad areas: Semiconductor Devices, Circuits and Systems, Signals and Systems, Power and Energy Systems, and… more
    The University Of Texas At Dallas (10/11/25)
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  • Operations Project Management Manager (OPM M2)

    Northrop Grumman (Apopka, FL)
    …Manager_** _(OPM Manager M2)_ _based out of_ **_Apopka, FL._** _Northrop Grumman's semiconductor foundry, packaging , integration, and test lines have unique ... 6 years of relevant experience_ + _2+ years' experience in Semiconductor or Advanced Packaging Manufacturing_ + _5+ years of experience leading people and/or… more
    Northrop Grumman (10/04/25)
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  • Principal Technical Services Project Management

    Northrop Grumman (Apopka, FL)
    …(OPM)_** **_Microelectronics_** _based out of_ **_Apopka, FL_** _._ _Northrop Grumman's semiconductor foundry, packaging , integration, and test lines offer ... integrated program team, or cost account manager._ + _2+ years' experience in Semiconductor or Advanced Packaging manufacturing._ + _Experience with Earned Value… more
    Northrop Grumman (10/04/25)
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  • Procurement Manager

    Fujifilm (Mesa, AZ)
    …this position leads procurement strategy and execution for direct materials ( semiconductor -grade chemicals, packaging , and filtration) while also overseeing MRO ... USA, Inc.,** is a global leader in chemical solutions which enable the semiconductor industry and the digital universe. We have an exciting opportunity at our… more
    Fujifilm (10/28/25)
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  • Associate, Electrical Engineer - CCA Design (Palm…

    L3Harris (Palm Bay, FL)
    packaging and MEMS technology + Experience with high density interconnect and semiconductor packaging technology is desired + Determine design approaches and ... parameters + Perform system analysis to determine feasibility of design within time and cost constraints + Utilize modeling tools and equipment to establish operating data, conduct experimental tests, and evaluate results + Select components and equipment… more
    L3Harris (12/04/25)
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  • Principal Engineer (EDA)

    Insight Global (Austin, TX)
    …and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging , and in the process to ... and Requirements 8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows. Deep technical… more
    Insight Global (12/02/25)
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  • Principal Thermal Simulation Engineer, APTD

    Micron Technology, Inc. (Boise, ID)
    …who is optimistic and responsible. **Job Responsibilities:** + Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (12/10/25)
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  • Modeling and Simulation Engineer

    Insight Global (Austin, TX)
    …defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging , and in the process ... including thermal management, etc. Key Responsibilities: Develop simulation models for semiconductor processes in advanced packaging , including modeling of plate… more
    Insight Global (10/29/25)
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  • MEMS Technical Program Manager, Technical Leader

    Cisco (San Jose, CA)
    …experience in one or more of the following areas: MEMS fabrication, semiconductor manufacturing, optical packaging and fiber optic components, electronic ... Team:** Work as part of a world class photonics team on MEMS packaging of optical components and their integration into Cisco's volume transceiver products. Cisco… more
    Cisco (11/27/25)
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  • Staff Hardware Systems Architect

    Google (Mountain View, CA)
    …serial interconnects. + Knowledge of chiplet-based design methodologies and advanced semiconductor packaging technologies (eg, 2.5D/3D integration). + Expertise ... in datacenter networking, including leaf-spine topologies and RDMA. + Working knowledge of transformer-based large language models is a plus. + Knowledge of high-performance and low-power architectures for ML acceleration. + Exceptional problem-solving and… more
    Google (11/21/25)
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