- Global Foundries (Malta, NY)
- About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication ... Package and chip assembly Engineering role will develop industry leading advanced packaging utilizing assembly techniques to enable 2.5D and 3D packaging … more
- GE Aerospace (Pompano Beach, FL)
- …in semiconductor manufacturing with a focus on power module packaging . **Additional Information** + GE Aerospace will not sponsor individuals for employment ... it happen. The Advanced Lead - SiC/GaN Power Module Packaging Engineer will focus on the design of power...for both GaN and SiC power modules. These advanced semiconductor power modules are critical for high-efficiency high power… more
- Global Foundries (Malta, NY)
- About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication ... GLOBALFOUNDRIES is seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced Silicon Photonics optical lab,… more
- Global Foundries (Malta, NY)
- About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication ... leading electro-optical transceiver s using GF 's Photonix platform and advanced packaging 2.5D and 3D co-packaged optic form fact ors meeting customer requirements.… more
- Global Foundries (Malta, NY)
- About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication ... leading electro-optical transceiver s using GF 's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form fact ors meeting customer… more
- Global Foundries (Malta, NY)
- About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication ... to become part of our Advanced Silicon Photonic (SiPh) Packaging team . The work location will be in...- 2 Year Technical/Associates Degree in Science, Math, Engineering, Semiconductor Manufacturing or a related discipline or equivalent military… more
- Micron Technology, Inc. (Boise, ID)
- …and advance faster than ever. **Department Introduction** Join Micron's Advanced Packaging Technology Development (TD) team, where innovation meets precision in ... technologies. Our team drives ground breaking solutions that enhance semiconductor performance and reliability. **Position Overview** As an Advanced Package… more
- Micron Technology, Inc. (Boise, ID)
- …world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
- Micron Technology, Inc. (Boise, ID)
- …Physics or Mechanical Engineering + Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor industry, Micron is ... innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and… more
- UCLA Fielding School of Public Health (Los Angeles, CA)
- …as well as emerging cross-disciplinary areas, with particular interest towards * Semiconductor materials, devices, and packaging for applications including but ... not limited to electronics, interconnects, optoelectronics, quantum phenomena, and subsystem demonstrators. * Quantum science and engineering, targeting both experimental and theoretical studies in systems towards frontier quantum computation (including… more