• IC Packaging Test Engineer , Silicon…

    SpaceX (Bastrop, TX)
    …We are looking for talented hands-on and dynamic test engineers with expertise in semiconductor packaging and wafer test. You will work closely with test ... IC Packaging Test Engineer , Silicon Technology (Starlink)...AND EXPERIENCE: + 3+ years industry experience with microelectronics packaging development + Advanced technical degree +… more
    SpaceX (10/30/25)
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  • Packaging Engineer

    Texas Instruments (Santa Clara, CA)
    …of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies ... presenting at international conferences or symposiums related to power electronics, semiconductor packaging , or high-voltage technologies **Base Range Info:**… more
    Texas Instruments (09/26/25)
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  • Advanced Lead - SiC/GaN Power Module…

    GE Aerospace (Pompano Beach, FL)
    …in our talented people to make it happen. The Advanced Lead - SiC/GaN Power Module Packaging Engineer will focus on the design of power modules along with ... development , optimization, and implementation of manufacturing processes for both...semiconductor manufacturing with a focus on power module packaging . **Additional Information** + GE Aerospace will not sponsor… more
    GE Aerospace (11/06/25)
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  • Silicon Photonics Chip Assembly & Packaging

    Global Foundries (Malta, NY)
    …full-service semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's most inspired ... MS, or PhD + 5 or more years of experience + Experienced packaging assembly development , bringing processes and products from development into production. +… more
    Global Foundries (10/23/25)
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  • Sr Wet Process Engineer , Advanced…

    Micron Technology, Inc. (Boise, ID)
    …other related field + 0-6 years of direct experience working as a process development engineer in an R&D environment + Knowledge of Advanced Package Integration ... the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (12/09/25)
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  • Fulltime- Raytheon Product Design…

    RTX Corporation (Tucson, AZ)
    …all technical and supplier related issues. Throughout the product lifecycle the Product Development Engineer (PDE) follows our Integrated Product Development ... tough, meaningful problems that create a safer, more secure world. The Product Development and Packaging Department is looking for individuals to support the… more
    RTX Corporation (10/09/25)
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  • Advanced Packaging Process Engineer

    Micron Technology, Inc. (Boise, ID)
    …that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for starting up, developing ... and advance faster than ever. **Department Intro:** The Technology Development (TD) department at Micron Technology is at the...+ Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor more
    Micron Technology, Inc. (09/24/25)
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  • Process Engineer - Packaging

    Fujifilm (Santa Clara, CA)
    **Position Overview** **POSITION SUMMARY:** Process Development Engineer II will play key role in developing new MEMS-based inkjet printhead products and ... degree in Engineering, Material Science, Chemistry, or Physics. . Experience with semiconductor packaging technologies . Experience with epoxy chemistry .… more
    Fujifilm (11/18/25)
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  • High Voltage Packaging Engineering Manager

    Texas Instruments (Dallas, TX)
    …of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies ... at international conferences or symposiums related to power electronics, semiconductor packaging , or high-voltage technologies **ECL/GTC Required:** Yes more
    Texas Instruments (10/15/25)
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  • Principal / Senior Principal Engineer

    Northrop Grumman (Linthicum Heights, MD)
    …military platforms. **You'll Get To:** Bring your comprehensive understanding of semiconductor die packaging -from wafer preparation through hermetic sealing and ... interact and impact device performance, yield, and long-term reliability. Drive design-for- packaging into product development lifecycles. + Technical Authority:… more
    Northrop Grumman (11/01/25)
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