• Packaging Engineering Intern MS/PhD

    Texas Instruments (Dallas, TX)
    …to help with the design, development , and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded ... cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip,...Put your talent to work with us as a Packaging Engineering Intern ! **Why TI?** + Engineer more
    Texas Instruments (09/17/25)
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  • Advanced Packaging Laser Engineer

    Applied Materials (Santa Clara, CA)
    …build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the ... (https://hrportal.ehr.com/applied/) . **Key Responsibilities** + Laser process and hardware development + Design, collect data, analyze and compile reports on… more
    Applied Materials (08/07/25)
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  • High Voltage Packaging Engineering Manager

    Texas Instruments (Dallas, TX)
    …of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies ... at international conferences or symposiums related to power electronics, semiconductor packaging , or high-voltage technologies **ECL/GTC Required:** Yes more
    Texas Instruments (10/15/25)
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  • Silicon Photonics Technology Development

    Global Foundries (Malta, NY)
    …full-service semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's most inspired ... new college graduate professionals to support the state of the art 300mm semiconductor manufacturing and development in Malta, New York. The core… more
    Global Foundries (09/22/25)
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  • Equipment Integration Engineer

    Insight Global (Austin, TX)
    …defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging , and in the process ... and Requirements 3 + years of experience as a Equipment Integration Engineer Prior experience writing Equipment Interfaces between semiconductor process and… more
    Insight Global (10/10/25)
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  • Mechanical Characterization Engineer II

    Insight Global (Austin, TX)
    …design, characterization, and/ or process integration. Solid understanding of semiconductor packaging technologies, including wire bonding, flip-chip, ... Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging , and...to detail. Experience in a startup or research and development (R&D) environment. Prior experience in semiconductor more
    Insight Global (09/09/25)
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  • Sr Principal Engineer Microelectronic…

    Northrop Grumman (Linthicum Heights, MD)
    …military platforms. **You'll Get To:** Bring your comprehensive understanding of semiconductor die packaging -from wafer preparation through hermetic sealing and ... interact and impact device performance, yield, and long-term reliability. Drive design-for- packaging into product development lifecycles. + Technical Authority:… more
    Northrop Grumman (09/23/25)
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  • Modeling and Simulation Engineer

    Insight Global (Austin, TX)
    …defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging , and in the process ... Insight Global is looking for a Modeling & Simulation Engineer to work on site in Austin, TX and...thermal management, etc. Key Responsibilities: Develop simulation models for semiconductor processes in advanced packaging , including modeling… more
    Insight Global (09/09/25)
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  • Principal Engineer (EDA)

    Insight Global (Austin, TX)
    …and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging , and in the process to ... Job Description Insight Global is looking for a Principal Engineer (EDA) that will be working on site in...8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows.… more
    Insight Global (09/09/25)
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  • Sr Principal Process Engineer

    Northrop Grumman (Linthicum Heights, MD)
    …Manufacturing, or Electrical Engineering. + 5+ years of experience in semiconductor packaging , assembly, or microelectronics manufacturing. + Experience ... of Baltimore, Maryland - is where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging… more
    Northrop Grumman (09/20/25)
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