• Advanced Packaging Process Engineer…

    Micron Technology, Inc. (Boise, ID)
    …that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for starting up, developing ... + Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor... Packaging As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more
    Micron Technology, Inc. (06/25/25)
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  • Advanced Packaging Research Engineer

    IBM (Albany, NY)
    …problems. **Preferred technical and professional experience** 1) Hands on experience in semiconductor 3D packaging technology, 2) More than 5 years experience ... of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process, 3) Experience w/… more
    IBM (06/27/25)
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  • Principal Engineer , Packaging…

    SanDisk (Milpitas, CA)
    …RESPONSIBILITIES: + As a Packaging Engineer , you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash ... academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in thermal sciences with… more
    SanDisk (05/31/25)
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  • Process Engineer - Packaging…

    Fujifilm (Santa Clara, CA)
    …degree in Engineering, Material Science, Chemistry, or Physics. . Experience with semiconductor packaging technologies . Experience with epoxy chemistry . ... **Position Overview** **POSITION SUMMARY:** Process Development Engineer II will play key role in developing...capabilities in assembly operation. Develop and improve print head packaging processes and technology. Own tools and the processes… more
    Fujifilm (05/20/25)
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  • Advanced Packaging Technology Development…

    Micron Technology, Inc. (Boise, ID)
    …Summary:** We are looking for a proactive and technically skilled APTD Shift Lead Engineer to lead a team of engineers and technicians in a fast-paced ... semiconductor manufacturing environment. This role is pivotal in driving...or related technical field, or 4+ years of equivalent semiconductor experience (or equivalent trade school/military experience). + 2+… more
    Micron Technology, Inc. (06/28/25)
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  • Electrical Engineer - Microelectronics…

    L3Harris (Palm Bay, FL)
    …domains in the interest of national security. Job Title: Senior Specialist, Advanced Packaging Integration Job Code: 23736 Job Location: Palm Bay, FL Job Schedule: ... This position is responsible for the development and execution of advanced packaging assembly processes including hybrid and thermocompression bonding . The lead… more
    L3Harris (05/07/25)
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  • Senior Packaging Process Engineer

    Applied Materials (Santa Clara, CA)
    …build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the ... discipline or field + This role's focus is 3D packaging and hybrid bonding. Must have skills are: flip...have skills are: flip chip assembly, 2.5D / 3D packaging , wafer level assembly, and hybrid bonding. **Business Expertise**… more
    Applied Materials (07/28/25)
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  • Advanced Packaging Laser Engineer…

    Applied Materials (Santa Clara, CA)
    …build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the ... foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make… more
    Applied Materials (05/13/25)
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  • High Voltage Packaging Engineering Manager

    Texas Instruments (Dallas, TX)
    …of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies ... at international conferences or symposiums related to power electronics, semiconductor packaging , or high-voltage technologies **ECL/GTC Required:** Yes more
    Texas Instruments (07/16/25)
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  • Staff R&D Engineer Adv Tech Dev

    Broadcom (San Jose, CA)
    …with IP design teams to support adaptation of existing IP into various semiconductor packaging environments + Assist with technology road mapping activity for ... for IP & ASIC to create robust designs in line with advanced semiconductor and packaging process flows & constraints + Work closely with technology experts and… more
    Broadcom (07/11/25)
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