- SpaceX (Bastrop, TX)
- …We are looking for talented hands-on and dynamic test engineers with expertise in semiconductor packaging and wafer test. You will work closely with test ... PREFERRED SKILLS AND EXPERIENCE: + 7+ years industry experience with microelectronics packaging development + Advanced technical degree + Expertise in developing… more
- SpaceX (Bastrop, TX)
- …We are looking for talented hands-on and dynamic test engineers with expertise in semiconductor packaging and wafer test. You will work closely with test ... PREFERRED SKILLS AND EXPERIENCE: + 3+ years industry experience with microelectronics packaging development + Advanced technical degree + Expertise in developing… more
- Texas Instruments (Santa Clara, CA)
- …of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies ... presenting at international conferences or symposiums related to power electronics, semiconductor packaging , or high-voltage technologies **Base Range Info:**… more
- GE Aerospace (Pompano Beach, FL)
- …ensure manufacturability and scalability of new GaN and SiC power module designs. ** Process Development ** : + Develop and optimize manufacturing processes for ... procedures (SOPs). + Prepare technical reports and presentations to communicate process development and improvement activities. **Training and Support** :… more
- Micron Technology, Inc. (Boise, ID)
- …Physics or Mechanical Engineering + Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor industry, Micron is ... learn, communicate and advance faster than ever. **Department Intro:** The Technology Development (TD) department at Micron Technology is at the forefront of… more
- Fujifilm (Santa Clara, CA)
- **Position Overview** **POSITION SUMMARY:** Process Development Engineer II will play key role in developing new MEMS-based inkjet printhead products and ... of current and new manufacturing processes, including tooling and fixture design, process development and build. . Employ an extensive technical knowledge… more
- Global Foundries (Malta, NY)
- …an OSAT ecosystem. + Experience completing failure analysis, design of experiments, & packaging process integration. + Expertise in chip package interaction for ... semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...+ 5 or more years of experience + Experienced packaging assembly development , bringing processes and products… more
- Global Foundries (Malta, NY)
- …of experience + Extensive experience with failure analysis, design of experiments, & packaging process integration . + Experience in bringing packaged products ... semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...transceiver s using GF 's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form fact ors… more
- Micron Technology, Inc. (Boise, ID)
- …and statistical analysis tools + Interest in advanced packaging and interconnect development As a world leader in the semiconductor industry, Micron is ... such as KT (Kepner-Tregoe) + Define and implement Design of Experiments (DoE) for process development + Present findings and collaborate across sites and teams +… more
- Global Foundries (Malta, NY)
- …background . + E xperience with failure analysis, design of experiments, & packaging process integration . + Validated record of photonic and electrical ... semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...transceiver s using GF 's Photonix platform and advanced packaging 2.5D and 3D co-packaged optic form fact ors… more