• IC Package Designer

    Data Device Corporation (Bohemia, NY)
    IC Package Designer Department: Engineer Location:Bohemia, NY For more than 60 years, Data Device Corporation (DDC) has been recognized as a world leader in the ... closely with substrate, material and package suppliers to align design with process capabilities and technologies to ensure design meets electrical and mechanical… more
    Data Device Corporation (09/03/25)
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  • Sr. Director, Engineering

    Skyworks (Andover, MA)
    …+ Detailed knowledge of RFIC and analog components including Switch/LNA/PA and semiconductor process technologies such as CMOS, GaAs/Silicon HBT, SOI, BiCMOS ... will take an active leadership role in concept/architecture development, design, integration , and delivery of complex multichip module solutions including RF and… more
    Skyworks (08/21/25)
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