• Sr Principal Semiconductor Electroplating…

    Northrop Grumman (Apopka, FL)
    …an experienced and motivated **Senior Principal Microelectronics Semiconductor Electroplating Process Engineer ** for our Advanced Packaging Technology ... technology meets the most demanding challenges. The **Senior Principal Microelectronic Semiconductor Electroplating Process Engineer ** will provide senior… more
    Northrop Grumman (08/08/25)
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  • Staff Semiconductor Process

    Lockheed Martin (Goleta, CA)
    …If you're a motivated and experienced engineer with a passion for process engineering and a strong background in semiconductor manufacturing, we encourage ... **Description:** You will be a Focal Plane Array Process Engineer with our Infrared Sensors...in Engineering, Physics, or related discipline\. * Experience in semiconductor packaging or FPA manufacturing in a… more
    Lockheed Martin (08/21/25)
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  • Semiconductor Display Product Test…

    Meta (Sunnyvale, CA)
    …experience in semiconductor test engineering, product engineering, REL / QUAL, process engineering, or advanced integration and packaging (eg CoWoS) 14. ... We are looking for a highly skilled and driven Semiconductor Display Product Test Engineer to join...physics, especially LEDs and microLEDs 21. Expertise in advanced semiconductor packaging technologies such as COWOS, wafer… more
    Meta (10/20/25)
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  • Principal Application Engineer

    Henkel (Irvine, CA)
    … advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package + Expertise in ... Principal Application Engineer _ Semiconductor Advanced Package **_About_**...wafer level encapsulation and molding process in semiconductor package + Have strong… more
    Henkel (08/20/25)
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  • Optical Packaging Engineer

    Texas Instruments (Dallas, TX)
    **Optical Packaging Engineer ** **Location: Dallas, TX or Santa Clara, CA** **Group: Kilby Labs** **We can't predict what the future holds, but we know Texas ... the Position** **Kilby Labs is seeking a highly motivated and experienced Optical Packaging Engineer to lead the development and implementation of innovative … more
    Texas Instruments (09/02/25)
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  • Staff Design Engineer , TSV…

    Micron Technology, Inc. (Boise, ID)
    …Experience in performing fracture simulations for IC packages. + Experience in semiconductor process simulation like wafer-to-wafer bonding process , thermal ... leadership in the industry. **Position Overview:** We are seeking a Staff Design Engineer to join our TSV Packaging team. High-performance memory devices like… more
    Micron Technology, Inc. (10/08/25)
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  • Career Accelerator Program - Packaging

    Texas Instruments (Dallas, TX)
    …3.0/4.0 GPA, or higher **Preferred Qualifications:** + Basic understanding of statistical process control (SPC) + Semiconductor packaging knowledge is ... help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for...prevent the use of high risk designs. As a Packaging engineer you will enjoy an environment… more
    Texas Instruments (09/06/25)
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  • Advanced packaging process

    Global Foundries (Malta, NY)
    …markets. For more information, visit www.gf.com . Summary of Role: This a dvanced packaging process integration development engineer ing role will lead post ... About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design,...line s . Essential Responsibilities: + Lead wafer level packaging process development efforts and planning by… more
    Global Foundries (09/30/25)
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  • Advanced Lead - SiC/GaN Power Module…

    GE Aerospace (Pompano Beach, FL)
    …have to offer. A GaN (Gallium Nitride) and SiC (Silicon Carbide) Power Module Packaging Engineer focuses on the design of power modules along with development, ... high power density power electronics. **Job Description** The Power Module Packaging Engineer is responsible for developing, optimizing, and implementing… more
    GE Aerospace (08/07/25)
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  • Packaging Engineer

    Texas Instruments (Santa Clara, CA)
    …of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies ... presenting at international conferences or symposiums related to power electronics, semiconductor packaging , or high-voltage technologies **Base Range Info:**… more
    Texas Instruments (09/26/25)
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