• Principal Engineer , Packaging

    SanDisk (Milpitas, CA)
    …RESPONSIBILITIES: + As a Packaging Engineer , you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash ... experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in...can successfully navigate our careers website and our hiring process . Please contact us at ###@sandisk.com to advise us… more
    SanDisk (09/05/25)
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  • Fulltime- Raytheon Product Design…

    RTX Corporation (Tucson, AZ)
    …problems that create a safer, more secure world. The Product Development and Packaging Department is looking for individuals to support the circuit card design ... process turning designs into robust and reliable reality. Individuals...related issues. Throughout the product lifecycle the Product Development Engineer (PDE) follows our Integrated Product Development System to… more
    RTX Corporation (10/09/25)
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  • Advanced Packaging Laser Engineer

    Applied Materials (Santa Clara, CA)
    …build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the ... more about our benefits (https://hrportal.ehr.com/applied/) . **Key Responsibilities** + Laser process and hardware development + Design, collect data, analyze and… more
    Applied Materials (08/07/25)
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  • High Voltage Packaging Engineering Manager

    Texas Instruments (Dallas, TX)
    …of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies ... at international conferences or symposiums related to power electronics, semiconductor packaging , or high-voltage technologies **ECL/GTC Required:** Yes more
    Texas Instruments (10/15/25)
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  • Sr Principal Engineer Microelectronic…

    Northrop Grumman (Linthicum Heights, MD)
    …reliability requirements of aerospace and defense applications. **Key Responsibilities** + Packaging Process Leadership: Own end-to-end packaging flows, ... military platforms. **You'll Get To:** Bring your comprehensive understanding of semiconductor die packaging -from wafer preparation through hermetic sealing and… more
    Northrop Grumman (09/23/25)
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  • Sr Principal Process Engineer

    Northrop Grumman (Linthicum Heights, MD)
    …We are looking for you to join our team as a **Senior Principal** **Microelectronics Process Engineer ** based out of **Linthicum, MD** . We are seeking a highly ... Manufacturing, or Electrical Engineering. + 5+ years of experience in semiconductor packaging , assembly, or microelectronics manufacturing. + Experience… more
    Northrop Grumman (09/20/25)
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  • Equipment Integration Engineer

    Insight Global (Austin, TX)
    …Equipment Integration Engineer Prior experience writing Equipment Interfaces between semiconductor process and metrology tools and MES systems. Bachelor's ... state-of-the-art in critical semiconductor domains such as advanced packaging , and in the process to help restore US leadership in semiconductor more
    Insight Global (10/10/25)
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  • Wafer/FPA Fab/ Process Engineer

    Teledyne (Montgomeryville, PA)
    …the excitement of being on a team that wins. **Job Description** **Position Summary:** Semiconductor wafer fab/ process engineer for advanced IR detectors and ... process development and production, from junior to mid-level engineer , in a high growth, high technology, high reward,... wafer processes and related chemicals * Experience in photonics/ semiconductor packaging , as well as in … more
    Teledyne (08/23/25)
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  • Principal Process Engineer , Die…

    Micron Technology, Inc. (Boise, ID)
    Semiconductor Process Engineering + Solid engineering knowledge of semiconductor advanced packaging die stacking processes + Skilled at designing valid ... of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Die Bonding, you will be primarily responsible for… more
    Micron Technology, Inc. (10/11/25)
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  • Mechanical Characterization Engineer II

    Insight Global (Austin, TX)
    …characterization, and/ or process integration. Solid understanding of semiconductor packaging technologies, including wire bonding, flip-chip, wafer-level ... Description Insight Global is looking for a Mechanical Characterization Engineer II to work on site in Austin, TX...in critical semiconductor domains such as advanced packaging , and in the process to help… more
    Insight Global (09/09/25)
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