• Automation Engineer

    Northrop Grumman (Linthicum Heights, MD)
    …as emerging programs. We have over 21,000 square feet of Class 100 wafer fabrication cleanroom that supports variants of Silicon, Gallium Arsenide, Gallium Nitride, ... is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly. The candidate must be a strong team… more
    Northrop Grumman (12/05/25)
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  • Process and Equipment Technician - Veterans…

    Micron Technology, Inc. (Boise, ID)
    …seeking highly motivated Process and Equipment Maintenance Technicians to support wafer fabrication in a dynamic, innovative manufacturing environment. In this role, ... equipment; manage up to 25 online manufacturing systems. + Support wafer process efficiency, quality, and innovation through collaboration with cross-functional… more
    Micron Technology, Inc. (12/04/25)
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  • Principal / Sr. Principal Factory Manufacturing…

    Northrop Grumman (Linthicum Heights, MD)
    …of a manufacturing execution system (MES) for a new superconducting electronics wafer fabrication line + Maintain awareness of MES setup and integration schedule ... in setting up an MES to support a new wafer fab manufacturing line + Collaborate with the vendor...core MES subcomponents, such as equipment, process plan, test wafer setup, user security, constraints, contamination, lot management, etc… more
    Northrop Grumman (11/21/25)
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  • Yield and Integration Engineer

    Teledyne (Goleta, CA)
    …and reporting role, ideal candidate will have some experience in: + Semiconductor wafer processing + Programming skills in: Python, Matlab, R, JMP, or similar + ... (DOE/ANOVA) + Optical microscopy + SEM/FIB + Profilometry, ellipsometry, X-Section, wafer stress + Other elemental analysis methods (TOF-SIMS, EDX, & Auger)… more
    Teledyne (11/14/25)
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  • Principal Process Engineer, APTD Bonding

    Micron Technology, Inc. (Boise, ID)
    …within the semiconductor industry + Technical knowledge and hands-on experience in die-to- wafer and wafer -to- wafer bonding processes and equipment is ... a must! + Strong architectural sense to translate process/design into technical requirements and specifications + 10+ years expertise in data extraction, analysis, and reporting tools such as JMP, Python, R + In-depth understanding of process flows,… more
    Micron Technology, Inc. (11/12/25)
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  • Semiconductor Process Engineer

    Teledyne (Camarillo, CA)
    …infrared and visible detector arrays. This position requires working together with the wafer production processing team in the cleanroom to sustain the quality and ... as follows. Other duties may be assigned. + Process integration and wafer fabrication, including photolithography, wet and dry etching, annealing, thin film,… more
    Teledyne (11/08/25)
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  • Hardware Engineering Manager - Semiconductor Test…

    Teradyne (Agoura Hills, CA)
    …cell architecture, cross-functional team leadership, and a strong understanding of both wafer -level and packaged device testing. The ideal candidate will have a ... control systems, and automation workflows. + Drive platform development for wafer -level and packaged device testing, ensuring optimal performance and reliability. +… more
    Teradyne (10/28/25)
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  • Intern - DRAM Product Engineer

    Micron Technology, Inc. (Boise, ID)
    …simulation, failure analysis, yield optimization, and test program development across wafer , component, and module levels. **Responsibilities** + Perform wafer ... activities. + Contribute to yield optimization and test program development for wafer , component, and module steps. **Minimum Qualifications** + Enrolled in a… more
    Micron Technology, Inc. (10/25/25)
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  • Postdoctoral Fellow (PREP0003261) - #Faculty

    Johns Hopkins University (Gaithersburg, MD)
    …models, determine uncertainties, and combined these properties into a hybrid metrology digital wafer . - Perform wafer dicing, cleaning, and packaging of samples ... as a Research Grade Test Material to pair with the previously-determined digital wafer model. - Publish results in refereed scientific journals and present results… more
    Johns Hopkins University (10/23/25)
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  • Sr Manager of Packaging Assembly Integration

    Global Foundries (Malta, NY)
    …with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Responsibilities: + Drives high engagement and trust within their team and between teams to deliver beyond expectations. + Delivers results providing training and cross training to ensure highly team continuity and effectiveness. + Leads team to d efine… more
    Global Foundries (10/23/25)
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