• Electronic-Photonic Process Design Kit (PDK)…

    MIT Lincoln Laboratory (Lexington, MA)
    …material growth and characterization, fabrication (eg, silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging, and testing of electronic ... wafers at a 90-nm lithography node, which represents the most advanced silicon fab in the US Government lab system. * Compound Semiconductor Laboratory (CSL):… more
    MIT Lincoln Laboratory (05/09/25)
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