• Raytheon (Tucson, AZ)
    …This includes design and test activities that span preliminary design to integration . Products we develop support radar and datalink applications on a variety ... Frequency Structure Simulator (HFSS) or equivalentSystemVue/Genesys or equivalentAdvanced Design System (ADS) or equivalentThe ability to obtain and maintain a… more
    JobGet (05/06/25)
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  • Principal Engineer - HBM SOC Design…

    Micron Technology, Inc. (Richardson, TX)
    …and high-quality RTL development with the ability to write and test code in System Verilog. + Experience with automating IP integration using standards such as ... to enrich life. As an HBM SOC Design and Integration Engineer, you will be responsible for the design...stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called… more
    Micron Technology, Inc. (03/07/25)
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  • Systems Engineer Lead - Demo System

    The Boeing Company (El Segundo, CA)
    …technologies. This team is looking for a ** Systems Engineer Lead - Demo System (Senior or Principal )** to be based out of **El Segundo, California.** This ... system physical design. + Oversee development of Systems Electronics/Device Modeling and integration with larger...through-hole and intra-layer dielectric technologies, as well as 3D chip technologies. + Experience in working in an agile… more
    The Boeing Company (05/04/25)
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  • Heterogenous Integration IO Interposer…

    Micron Technology, Inc. (Richardson, TX)
    …will include, but are not limited to:** + Analyze HBM cube PDN integration partnering with IO design + Pathfinding to explore new HBM architectures, interposer ... end-to-end die to interposer to substrate level heterogenous integrated systems + Parasitic modeling and design validation, reticle experiments...high-speed link, ESD + Familiar with one or more off- chip protocols such as HBM, UCIe or other DRAM… more
    Micron Technology, Inc. (04/17/25)
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  • Principal IC Packaging Engineer, Silicon…

    SpaceX (Bastrop, TX)
    …assembly processes including material characterization and down-selection for wafer-level and chip -level systems + Develop new technologies and establish ... development + Familiarity with 2D, 2.5D, and/or 3D packaging integration + Packaging familiarity with flip- chip , BGA,...chip , BGA, fcCSP, WLCSP, fan out FO processes, system -in-package SiP, multi- chip modules MCM, wirebond, panel… more
    SpaceX (04/15/25)
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  • Principal /MTS Memory System

    Micron Technology, Inc. (Boise, ID)
    …for integration . + Develop performance models to analyze memory system behavior under different workloads and identify bottlenecks in collaboration with power ... Intro:** The Micron Module Architecture team is seeking a highly skilled and experienced Principal Engineer, or Member of Technical Staff! This role would be a part… more
    Micron Technology, Inc. (03/18/25)
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  • JD System Power Architect…

    Micron Technology, Inc. (Boise, ID)
    …Intro:** The Micron Module Architecture team is seeking a highly skilled and experienced Principal Engineer, or Member of Technical Staff! This role would be a part ... at the board level, in collaboration with our product architects, chip designers, SI engineers, power architects, memory controller architects, and validation… more
    Micron Technology, Inc. (04/29/25)
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  • Sr. Principal ASIC/Analog Design Engineer

    Teledyne (Goleta, CA)
    …group is involved in early system trades as well as support for camera integration and production. You will be tasked take the lead in the design and analysis of ... volume cell phone and automotive cameras to high-end performance systems for security and search and track applications. This...and implementation of a large portion of the overall chip . While completing system level trades as… more
    Teledyne (04/03/25)
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  • Principal Analog IC Design Engineer

    Skyworks (Irvine, CA)
    Principal Analog IC Design Engineer Apply now " Date:Apr 21, 2025 Location: Irvine, CA, US Company: Skyworks If you are looking for a challenging and exciting career ... as guiding and helping the design community in their integration and performance verification via simulation. In this role...requirements from various design teams and work with our systems team to define the specifications for Skyworks' IP… more
    Skyworks (03/31/25)
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  • Principal IC Packaging Test Engineer,…

    SpaceX (Bastrop, TX)
    …and wafer test. You will work closely with test equipment manufacturers and in-house chip & system designers to develop and release production test solutions. ... Principal IC Packaging Test Engineer, Silicon Technology (Starlink)...to deploy Starlink, the world's most advanced broadband internet system . Starlink is the world's largest satellite constellation and… more
    SpaceX (04/15/25)
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