• Systems Engineer Lead - Demo System

    The Boeing Company (El Segundo, CA)
    …technologies. This team is looking for a ** Systems Engineer Lead - Demo System (Senior or Principal )** to be based out of **El Segundo, California.** This ... system physical design. + Oversee development of Systems Electronics/Device Modeling and integration with larger...through-hole and intra-layer dielectric technologies, as well as 3D chip technologies. + Experience in working in an agile… more
    The Boeing Company (06/26/25)
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  • Heterogenous Integration IO Interposer…

    Micron Technology, Inc. (Richardson, TX)
    …will include, but are not limited to:** + Analyze HBM cube PDN integration partnering with IO design + Pathfinding to explore new HBM architectures, interposer ... end-to-end die to interposer to substrate level heterogenous integrated systems + Parasitic modeling and design validation, reticle experiments...high-speed link, ESD + Familiar with one or more off- chip protocols such as HBM, UCIe or other DRAM… more
    Micron Technology, Inc. (04/17/25)
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  • Principal IC Packaging Engineer, Silicon…

    SpaceX (Bastrop, TX)
    …assembly processes including material characterization and down-selection for wafer-level and chip -level systems + Develop new technologies and establish ... development + Familiarity with 2D, 2.5D, and/or 3D packaging integration + Packaging familiarity with flip- chip , BGA,...chip , BGA, fcCSP, WLCSP, fan out FO processes, system -in-package SiP, multi- chip modules MCM, wirebond, panel… more
    SpaceX (04/15/25)
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  • Principal /MTS Memory System

    Micron Technology, Inc. (Boise, ID)
    …for integration . + Develop performance models to analyze memory system behavior under different workloads and identify bottlenecks in collaboration with power ... Intro:** The Micron Module Architecture team is seeking a highly skilled and experienced Principal Engineer, or Member of Technical Staff! This role would be a part… more
    Micron Technology, Inc. (06/12/25)
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  • JD System Power Architect…

    Micron Technology, Inc. (Boise, ID)
    …Intro:** The Micron Module Architecture team is seeking a highly skilled and experienced Principal Engineer, or Member of Technical Staff! This role would be a part ... at the board level, in collaboration with our product architects, chip designers, SI engineers, power architects, memory controller architects, and validation… more
    Micron Technology, Inc. (06/12/25)
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  • Principal FPGA Design Engineer - $10K Sign…

    BAE Systems (Westminster, CO)
    …of concept, and production programs. + FPGA development and digital IP integration for tactical RF, high reliability electronic systems . Assignments include ... advanced function implementation in FPGAs. + Solid electronic circuit design and electronic systems background. + Expertise in VHDL/Verilog and System Verilog. +… more
    BAE Systems (06/13/25)
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  • Sr. Principal ASIC/Analog Design Engineer

    Teledyne (Goleta, CA)
    …group is involved in early system trades as well as support for camera integration and production. You will be tasked take the lead in the design and analysis of ... volume cell phone and automotive cameras to high-end performance systems for security and search and track applications. This...and implementation of a large portion of the overall chip . While completing system level trades as… more
    Teledyne (04/03/25)
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  • Software/ Principal Software Engineer

    Northrop Grumman (Rolling Meadows, IL)
    … that utilize Parallel Processing, Multi-Threading, Distributed Processing, Multi-Core, System -on- Chip , and Secure Processing. + Active Secret Clearance ... our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today,...be a part of our mission! As a Software Engineer/ Principal Software Engineer at Northrop Grumman you will have… more
    Northrop Grumman (06/18/25)
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  • Principal Engineer - Infotainment…

    Ford Motor Company (Palo Alto, CA)
    …extensively within the Android Automotive OS framework, customizing the stack, optimizing system services, and ensuring tight integration with vehicle hardware ... Contribute significantly to the evaluation and selection process of new System -on- Chip (SoC) platforms, assessing performance, features, software support (SDKs,… more
    Ford Motor Company (05/22/25)
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  • Principal IC Packaging Test Engineer,…

    SpaceX (Bastrop, TX)
    …and wafer test. You will work closely with test equipment manufacturers and in-house chip & system designers to develop and release production test solutions. ... Principal IC Packaging Test Engineer, Silicon Technology (Starlink)...to deploy Starlink, the world's most advanced broadband internet system . Starlink is the world's largest satellite constellation and… more
    SpaceX (04/15/25)
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