• Distinguished Member of Technical Staff, Package…

    Micron Technology, Inc. (Boise, ID)
    … or Mechanical Engineering . + 15+ years of relevant experience in semiconductor packaging engineering or related fields. + Demonstrated success in ... outstanding role where you will build the future of semiconductor packaging technology. As a Semiconductor...innovation, crafting flawless designs from concept to market. This position is developed for a highly skilled professional with… more
    Micron Technology, Inc. (09/03/25)
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  • Staff RDA/Metrology Engineer, APTD

    Micron Technology, Inc. (Boise, ID)
    …generate data summaries and make statistically based recommendations + Experience in semiconductor process engineering and packaging with fundamental ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (09/04/25)
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  • Semiconductor Engineering Supervisor

    Ford Motor Company (Dearborn, MI)
    Ford's Semiconductor Engineering team is seeking a highly motivated and technically proficient supervisor to lead its Semiconductor Resiliency Taskforce. ... usage and/or automotive electronic module experience + Experience working with semiconductor packaging materials such as solders, ceramics, silicone gel,… more
    Ford Motor Company (09/27/25)
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  • Senior Principal Microelectronics…

    Northrop Grumman (Apopka, FL)
    …+ Bachelor's degree and a minimum of 8 years of experience in Microelectronics Semiconductor Engineering or Production OR a Master's degree and a minimum of ... to join our team as a **Senior Principal Microelectronics Semiconductor Photolithography Process Engineer** for our Advanced Packaging...6 years of experience in Microelectronics Semiconductor Engineering or Production OR a PhD… more
    Northrop Grumman (09/16/25)
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  • Assistant, Associate, or Full Professor…

    Suny Polytechnic Institute (Utica, NY)
    …or Professor level in Electrical Engineering , with specialization in semiconductor device design and familiarity with packaging technologies. We seek ... Description: SUNY Polytechnic Institute's Department of Electrical and Computer Engineering invites applications for a full-time tenured/tenure-track position more
    Suny Polytechnic Institute (09/30/25)
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  • Sr Principal Semiconductor Electroplating…

    Northrop Grumman (Apopka, FL)
    …Systems is seeking an experienced and motivated **Senior Principal Microelectronics Semiconductor Electroplating Process Engineer** for our Advanced Packaging ... of microelectronics. Our two US-based government-trusted foundries and state-of-the-art packaging facilities set the standard, designing and delivering millions of… more
    Northrop Grumman (08/08/25)
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  • Supply Chain Planner, Semiconductor AI/ML,…

    Amazon (Austin, TX)
    …*An ideal candidate must have:* Technical Expertise: Comprehensive knowledge of semiconductor manufacturing operations including wafer fab, advanced packaging ... Amazon Web Services company, we are pioneering the development of advanced semiconductor products that drive AWS cloud infrastructure. Our team leverages silicon and… more
    Amazon (09/25/25)
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  • Staff Semiconductor Process Engineer

    Lockheed Martin (Goleta, CA)
    …college in Engineering , Physics, or related discipline\. * Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with ... as epoxy die attach/bonding, polishing, substrate removal, or Anti\-Reflection \(AR\) coating or semiconductor packaging techniques\. * Must be a US Citizen, as… more
    Lockheed Martin (08/21/25)
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  • Principal Application Engineer…

    Henkel (Irvine, CA)
    … advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package + Expertise in ... Principal Application Engineer _ Semiconductor Advanced Package **_About_** **_this_** **_position_** At Henkel,...you'll do** + Technical service engineer who provides technical engineering support for Henkel's Advanced Packaging Material… more
    Henkel (08/20/25)
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  • Intern 2026: Hardware Engineer…

    IBM (Yorktown Heights, NY)
    …state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging . Background knowledge of engineering disciplines, computer science, ... and technology landscape includes Research, Software, and Infrastructure. Entering this domain positions you at the heart of IBM, where growth and innovation thrive.… more
    IBM (09/19/25)
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