• Semiconductor Display Product Test…

    Meta (Sunnyvale, CA)
    …III-V material physics, especially LEDs and microLEDs 21. Expertise in advanced semiconductor packaging technologies such as COWOS, wafer reconstitution, InFO, ... We are looking for a highly skilled and driven Semiconductor Display Product Test Engineer to join...integration process. You will work cross-functionally with design, systems, packaging , and other XFN teams to ensure robust, scalable,… more
    Meta (12/20/25)
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  • Principal Application Engineer

    Henkel (Irvine, CA)
    … materials. Your work directly impacts performance and reliability of next-generation semiconductor packaging technologies. + Serve as the technical lead for ... Principal Application Engineer - Semiconductor Advanced Package **_About_**...Henkel's advanced semiconductor packaging materials. + Work directly with… more
    Henkel (11/13/25)
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  • Staff Semiconductor Process Engineer

    Lockheed Martin (Goleta, CA)
    …accredited college in Engineering, Physics, or related discipline\. * Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with ... as epoxy die attach/bonding, polishing, substrate removal, or Anti\-Reflection \(AR\) coating or semiconductor packaging techniques\. * Must be a US Citizen, as… more
    Lockheed Martin (12/11/25)
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  • Intern 2026: Hardware Engineer

    IBM (Yorktown Heights, NY)
    …chip architecture, design, fabrication and test to advanced chip packaging . Background knowledge of engineering disciplines, computer science, physics, or ... * Physic * Chemistry **Preferred technical and professional experience** * Semiconductor fabrication knowledge/coursework IBM is committed to creating a diverse… more
    IBM (01/16/26)
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  • Intern 2026: Software Engineer

    IBM (Albany, NY)
    …towards state-of-the-art chip architecture, design, fabrication and advanced chip packaging . Background knowledge of computer science, data science, machine learning ... or other computational techniques are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions. **Required technical and professional expertise** * Computer Science * Information Technology *… more
    IBM (12/11/25)
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  • Semiconductor IT Professional

    IBM (Yorktown Heights, NY)
    …to Yorktown. The Engineer will need to have experience in a semiconductor or packaging facility and have experience with MES systems, preferably SiView. ... The engineer will be the lead for the logistics bring-up...with Semiconductor MES Systems. Experience working in Semiconductor or Packaging fabrication facility. IBM is… more
    IBM (01/08/26)
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  • Optical Packaging Engineer

    Texas Instruments (Dallas, TX)
    **Optical Packaging Engineer ** **Location: Dallas, TX or Santa Clara, CA** **Group: Kilby Labs** **We can't predict what the future holds, but we know Texas ... Labs is seeking a highly motivated and experienced Optical Packaging Engineer to lead the development and...fibers to semiconductor chips.** + **Experience in semiconductor packaging technology, including die attach, wire… more
    Texas Instruments (01/15/26)
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  • IC / Semiconductor Package Designer

    Broadcom (Irvine, CA)
    … Package Designer** **Role Overview** We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and ... Define and refine assembly BOM, process flows, and design rules for advanced packaging technologies. + Define POR for new silicon nodes including bump metallization,… more
    Broadcom (12/02/25)
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  • Career Accelerator Program - Packaging

    Texas Instruments (Dallas, TX)
    …organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and ... to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip,...prevent the use of high risk designs. As a Packaging engineer you will enjoy an environment… more
    Texas Instruments (01/09/26)
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  • Principal Design Engineer , TSV…

    Micron Technology, Inc. (Boise, ID)
    …leadership in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices ... collaborate, partner, and implement. **Responsibilities:** + Stay up-to-date on semiconductor and advanced electronics packaging technologies like High… more
    Micron Technology, Inc. (12/10/25)
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