• Packaging Technical Leader

    Cisco (San Jose, CA)
    …of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable ... flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development , reliability qualification, materials and testing. *… more
    Cisco (11/12/25)
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  • Semiconductor Display Product Test Engineer

    Meta (Sunnyvale, CA)
    …experience in semiconductor test engineering, product engineering, REL / QUAL, process engineering, or advanced integration and packaging (eg CoWoS) 14. ... III-V material physics, especially LEDs and microLEDs 21. Expertise in advanced semiconductor packaging technologies such as COWOS, wafer reconstitution, InFO,… more
    Meta (10/20/25)
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  • Principal Application Engineer…

    Henkel (Irvine, CA)
    …product lines and/or product classes by novel approaches to application process development , troubleshooting, and material characterization. **What makes you ... packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D...package + Expertise in wafer level encapsulation and molding process in semiconductor package + Have strong… more
    Henkel (11/13/25)
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  • Senior Program Manager, Chip Assembly…

    NVIDIA (Santa Clara, CA)
    …experience) + 12+ years of validated experience in Flip Chip semiconductor packaging design, process and materials development . Direct experience in ... advanced assembly technologies such as 2.5D/3D packaging , Photonics packaging experience is desirable + Solid technical knowledge of materials, process ,… more
    NVIDIA (11/15/25)
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  • Advanced Packaging Modeling Expert - FEA

    Applied Materials (Santa Clara, CA)
    …simulations to support the design, development , and qualification of next-generation semiconductor packaging technologies. You will play a key role in ... their interactions under thermal and mechanical loads. + Familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping,… more
    Applied Materials (10/21/25)
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  • Optical Packaging Engineer

    Texas Instruments (Dallas, TX)
    …science or related field.** + **5+ years of relevant experience in semiconductor package/ process development , including modeling, test development ... Labs is seeking a highly motivated and experienced Optical Packaging Engineer to lead the development and...fibers to semiconductor chips.** + **Experience in semiconductor packaging technology, including die attach, wire… more
    Texas Instruments (09/02/25)
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  • Staff Design Engineer, TSV Packaging

    Micron Technology, Inc. (Boise, ID)
    …Experience in performing fracture simulations for IC packages. + Experience in semiconductor process simulation like wafer-to-wafer bonding process , thermal ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
    Micron Technology, Inc. (10/08/25)
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  • Member of Technical Staff (MTS) - Advanced Silicon…

    Global Foundries (Malta, NY)
    …& qualification + Hands-on SiPh lab assembly tool operation and process development + Collaborating with design, integration, & packaging team in driving ... semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced… more
    Global Foundries (09/01/25)
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  • Career Accelerator Program - Packaging

    Texas Instruments (Dallas, TX)
    …to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded ... your very first day on the job. The TMG Development program is a 12-month program for new college...or higher **Preferred Qualifications:** + Basic understanding of statistical process control (SPC) + Semiconductor packaging more
    Texas Instruments (09/06/25)
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  • Intern - Process Integration - Advanced…

    Micron Technology, Inc. (Boise, ID)
    …under tight timelines and limited resources **Preferred Qualifications** + Experience with semiconductor process integration or packaging technologies + ... + Define and implement Design of Experiments (DoE) for process development + Communicate findings across local...+ Interest in advanced packaging and interconnect development As a world leader in the semiconductor more
    Micron Technology, Inc. (09/03/25)
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