• Henkel (Irvine, CA)
    … advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package + Expertise in ... Principal Application Engineer _ Semiconductor Advanced Package **_About_**...wafer level encapsulation and molding process in semiconductor package + Have strong… more
    DirectEmployers Association (11/13/25)
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  • Ralliant (Hollister, CA)
    **General Responsibilities:** As a Packaging Engineer with Pacific Scientific EMC, you will embed with Shipping as the internal customer to provide day-to-day ... shipping-related customer flowdowns as the basis for compliance in all other Packaging Engineer responsibilities. + Evaluate and select appropriate packaging… more
    DirectEmployers Association (08/28/25)
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  • Micron Technology, Inc. (Boise, ID)
    …development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be recognized as a domain expert in Fab ... team and contribute to the growth and innovation of the semiconductor industry. The Process Quality Engineering (PQE) team operates at the critical interface… more
    DirectEmployers Association (11/05/25)
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  • Micron Technology, Inc. (Boise, ID)
    …who is optimistic and responsible. **Job Responsibilities:** + Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High ... world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront… more
    DirectEmployers Association (10/07/25)
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  • Micron Technology, Inc. (Boise, ID)
    …of intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor process technology development, package development, design, and ... Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The...5 years of experience working with a variety of semiconductor design & process datasets. Proficient in… more
    DirectEmployers Association (09/13/25)
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  • Micron Technology, Inc. (Boise, ID)
    …generate data summaries and make statistically based recommendations + Experience in semiconductor process engineering and packaging with fundamental ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    DirectEmployers Association (09/04/25)
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  • Micron Technology, Inc. (Boise, ID)
    …experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience. ... to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson,… more
    DirectEmployers Association (10/17/25)
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  • Micron Technology, Inc. (Richardson, TX)
    …reliability! HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Design Engineer in sustaining role ... with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD)...will have an opportunity to rotate to a Design Engineer role and work on the next generation HBM… more
    DirectEmployers Association (10/02/25)
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  • Micron Technology, Inc. (Richardson, TX)
    …The HBM product family is growing due to high demand from industry leading semiconductor companies! As an HBM Memory Design Engineer in sustaining role you ... with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD)...will have an opportunity to rotate to a Design Engineer role and work on the next generation HBM… more
    DirectEmployers Association (09/28/25)
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  • Micron Technology, Inc. (Richardson, TX)
    …from industry leading semiconductor companies. As a HBM Memory Physical Design Engineer in sustaining role you will be working with teams like Design Engineering ... (DE), Product Engineering (PE), Process Integration (PI), Packaging and Technology Development...hybrid bonding, interposers). As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more
    DirectEmployers Association (10/02/25)
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