• Sr. Hardware Development Engineer

    Amazon (Austin, TX)
    …integrity. You will have demonstrated results in the architecture and development of high-speed, complex PCB designs for server components, including motherboards, ... You will have demonstrated results in the architecture and development of high-speed, complex PCB designs for server components,...may be provided as part of a total compensation package , in addition to a full range of medical,… more
    Amazon (06/02/25)
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  • Senior Project Manager, Practice Builder…

    Kimley-Horn (Miami, FL)
    …an opportunity for a motivated Senior Project Manager, Practice Builder, Forensic/Structural Engineer , SI , PE, to expand our Forensic/Structures practice in ... university in the field of Civil/Structural Engineering + Registered Florida Professional Engineer (PE) license + SI (Special Inspector) License, performing… more
    Kimley-Horn (05/20/25)
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  • Member of Technical Staff (MTS) - Advanced Silicon…

    Global Foundries (Malta, NY)
    …is seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced Silicon Photonics optical lab, ... You will be working with a diverse team of innovators on technology development for GLOBALFOUNDRIES 45SPCLO Si Photonic technology, along with interfacing with… more
    Global Foundries (06/03/25)
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  • Lead Advanced Microelectronics Packaging

    The Boeing Company (El Segundo, CA)
    …Defense Space & Security has an exciting opportunity as a **Lead Advanced Microelectronics Packaging Design Engineer ** . Come join us as part of our Electronics ... materials, SI /PI, thermal, systems, and production teams to optimize package solutions on cost, performance, manufacturability, and reliability + Interface with … more
    The Boeing Company (05/30/25)
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  • SMTS/Dmts, Silicon Package Integration…

    Micron Technology, Inc. (Boise, ID)
    …technology! **Position Overview:** As a Package Silicon Integrator in Advanced Packaging Technology Development (APTD), you will define and validate silicon- ... including HBM and 3DS DRAM. Collaborate with multi-functional teams, including Product Development , frontend Si TD, APTD, Manufacturing, and Global Quality. We… more
    Micron Technology, Inc. (06/03/25)
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  • Staff R&D/Product DVL Engineer (Remote)

    TE Connectivity (Berwyn, PA)
    …PAM4, PCIe Gen6/7, Co-Packaged, and Near Package ) through the product development cycle. * Conducting SI COE analysis, including * Performing signal ... faster, more connected world. **Responsibilities** As a Staff Product Development Engineer in the Signal Integrity Center...Engineer in the Signal Integrity Center of Excellence ( SI COE), you will lead advanced signal integrity (… more
    TE Connectivity (06/19/25)
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  • Principal R&D/ Signal Integrity Engineer

    TE Connectivity (PA)
    …PAM4, PCIe Gen6/7, Co-Packaged, and Near Package ) through the product development cycle. + Conducting SI COE analysis, including + Performing signal ... more connected world. **Job Overview** As a Staff Product Development Engineer in the Signal Integrity Center...Engineer in the Signal Integrity Center of Excellence ( SI COE), you will lead advanced signal integrity (… more
    TE Connectivity (05/06/25)
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  • Wire/Cable Sr R&D/Product DVL Engineer

    TE Connectivity (Northborough, MA)
    …Integrity Engineer provides support & advice for bulk cable development , This position interacts with Product Development Engineering, Manufacturing Process ... WIRE/CABLE SR R&D/PRODUCT DVL ENGINEER **At TE, you will unleash your potential...more connected world.** ​ **Job Overview** TE Connectivity's R&D/Product Development Engineering Teams conceive original ideas for new products,… more
    TE Connectivity (04/04/25)
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  • R&D Engineer IC Design

    Broadcom (San Jose, CA)
    …with packaging , signal integrity and foundries to meet the packaging , SI and physical requirements of the interposers. Experience with interposer ... Strong automation expertise related to bump pattern generation , routing structure development for high speed interfaces, and chip finishing are required to handle… more
    Broadcom (05/24/25)
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  • R&D Engineer Adv Tech Dev 1

    Broadcom (San Jose, CA)
    …node products (7nm, 5nm, 3nm and beyond) + Work with IC design, system design, package SI /PI & thermal engineering teams to design custom packages + Ensure ... support advanced node silicon (7nm & 5nm) POR definition + Manage IC packaging activity from concept through development , qualification and high volume… more
    Broadcom (05/14/25)
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