• Technical Specialist - Wiresaw Wafer

    Corning Incorporated (Hemlock, MI)
    Technical Specialist - Wiresaw Wafer Slicing **Date:** Apr 18, 2025 **Location:** Hemlock, MI, US, 48626 **Company:** Corning Requisition Number: 66267 **The company ... for providing technical leadership and expertise in diamond-coated wire (DCW) wiresaw wafer slicing process, ensuring the production of high-quality solar wafer more
    Corning Incorporated (03/24/25)
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  • Wafer Fab/Process Engineer

    Teledyne (Montgomeryville, PA)
    …being on a team that wins. **Job Description** **Position Summary:** Semiconductor wafer fab/process engineer for advanced IR detectors and focal plane arrays (FPAs) ... include the following. Other duties may be assigned. * Compound semiconductor wafer fabrication/processing * Photolithography * Wet and dry etchings * Thin film… more
    Teledyne (02/22/25)
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  • Staff Wafer Fab Quality Assurance Engineer

    Western Digital (Fremont, CA)
    …of data storage. **Job Description** **ESSENTIAL DUTIES AND RESPONSIBILITIES:** + Assure out-going wafer quality in FRE and GO + Perform FA and provide disposition ... error proofing, 6S, procedure, + Promote Quality Culture among wafer process and equipment engineering teams + Prepare and...years' or master's degree with 2 years' experience in wafer fab engineering of magnetic head, CMOS, or other… more
    Western Digital (05/07/25)
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  • Wafer Dicing Technician

    Teledyne (Camarillo, CA)
    …career to the next level with us** ! We are looking to add a ** Wafer Dicing Technician** to our team! You will be responsible for supporting and sustaining ... production activities in semiconductor wafer preparation and wafer dicing operation. **Essential Duties and Responsibilities** The primary duties and… more
    Teledyne (05/01/25)
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  • Hardware Engineer, Wafer Process…

    Google (Goleta, CA)
    …in a cleanroom environment. + Experience in one or more conventional wafer fabrication areas such as lithography, deposition, etch, photoresist strip, singulation, ... environments. + Experience in MEMS device fabrication, 3D integration, and wafer level packaging. + Experience with etching, thin film, materials characterization,… more
    Google (04/30/25)
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  • Wet Etch & Electroplating Wafer Engineering…

    Western Digital (Fremont, CA)
    …process and can create or edit process recipe as well as create or edit wafer level CRMS. + Good understanding of SPC chart and how to react to different ... using basic knowledge in statistics and data analysis. + Disposition hold wafer according to SPEC or disposition criteria provided by Process Engineer. Also… more
    Western Digital (04/11/25)
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  • CMP/Plating/ Wafer Bond Equipment…

    Broadcom (Fort Collins, CO)
    …Technician with Broadcom's Wireless Semiconductor Division (WSD), you'll sustain and improve our wafer fab equipment in support of existing as well as new processes ... hire highly talented & motivated technicians to maintain and improve our growing wafer fabrication equipment set. This position comes with a broad and rewarding set… more
    Broadcom (03/13/25)
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  • Wafer Fabrication Manufacturing Engineer,…

    Google (Fremont, CA)
    …practical experience. + 10 years of experience in a production semiconductor wafer fab cleanroom environment. + Experience applying Lean Manufacturing principles in ... of lithography, thin film, etch, clean, thermal, metrology/characterization and backside wafer thinning. + Ensure process robustness, efficiency and consistency by… more
    Google (03/28/25)
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  • Senior Test Engineer, Silicon Wafer

    Google (Fremont, CA)
    …to ensure high uptime of the test operations. + Interface with wafer -level probe cards, test equipment, and instrumentation to facilitate CMOS/silicon testing and ... characterization. + Identify, diagnose, and resolve electrical issues during wafer -level testing using digital oscilloscopes and other testing equipment. +… more
    Google (04/04/25)
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  • Wafer Fab Supervisor

    Teledyne (Goleta, CA)
    …the time in the cleanroom, and may work with our frontside fabrication ( wafer ) or backside fabrication (FPA). **Primary Duties & Responsibilities:** + Daily output ... and productivity tracking and reporting + Participate/lead in Lean manufacturing activities like VSM, 5S, continuous improvement + Facilitate coordination between development, engineering and operations + Balance workload to optimize productivity + Work with… more
    Teledyne (05/01/25)
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