• 2 . 5D Packaging

    Qualcomm (San Diego, CA)
    …or equivalent. + 15+ years of hands-on experience in packaging technology development in 2 . 5D /3D for high density D2D interconnects, RDL, fanout ... visible role, you will be responsible for developing advanced 2 . 5D packaging technologies and defining...for high performance computing. Extensive knowledge and experience in 2 . 5D package technology development including… more
    Qualcomm (07/25/25)
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  • Chip Packaging Engineering Manager

    Google (Sunnyvale, CA)
    … materials, and reliability requirements (component and board level). + Knowledge in 2 . 5D and 3D packaging technologies for high performance computing. ... practical experience. + 10 years of experience with package development for high volume production. + 3 years of...Experience in the thermal and mechanical modeling of silicon packaging . + Experience with the qualification process for advanced… more
    Google (06/13/25)
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  • HBM PHY Expert, Annapurna Labs

    Amazon (Cupertino, CA)
    …parameters and/or controller features -Drive the IP Integration and design of silicon and 2 . 5D packaging -Support the physical design team, review clocking ... a member of the UC organization, you'll support the development and management of Compute, Database, Storage, Internet of...have the opportunity to be responsible for IP integration, 2 . 5D design, bring up, Characterization and validation.… more
    Amazon (07/10/25)
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  • Sr. HBM PHY Expert, Annapurna Labs

    Amazon (Cupertino, CA)
    …parameters and/or controller features - Drive the IP Integration and design of silicon and 2 . 5D packaging - Support the physical design team, review clocking ... server integration. As a senior member of our platform development team, you will have the outstanding and meaningful...have the opportunity to be responsible for IP integration, 2 . 5D design, bring up, Characterization and validation.… more
    Amazon (06/06/25)
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  • Staff R&D Engineer Adv Tech Dev

    Broadcom (San Jose, CA)
    …FinFET and Gate All Around technology; Design experience is a plus + Working knowledge of 2 . 5D packaging technology and 3D stacked IC + Knowledge and use of ... login account before you apply for a job. (Click Sign In > Create Account)** ** 2 . If you already have a Candidate Account, please Sign-In before you apply.** **Job… more
    Broadcom (07/11/25)
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  • Principal Application Engineer _ Semiconductor…

    Henkel (Irvine, CA)
    …advanced packaging environment. + Good understanding for the latest Semiconductor Packaging trend. Especially 2 . 5D and 3D package + Expertise ... service engineer who provides technical engineering support for Henkel's Advanced Packaging Material products and responsible for developing in depth application… more
    Henkel (07/22/25)
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  • High Speed SerDes RTL Design Engineer

    Broadcom (San Jose, CA)
    …silicon photonics-based transceiver architectures and standards.** + **Good understanding of advanced packaging ( 2 . 5D / 3D) architectures.** + **Strong ... for a job. (Click Sign In > Create Account)** ** 2 . If you already have a Candidate Account, please...you will be responsible for leading the design and development of highly integrated SerDes solutions for the next… more
    Broadcom (07/11/25)
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