- Broadcom Inc. (San Jose, CA)
- …requires aspects of a successful layout engineer, an electrical background, a strong interest in 2 . 5D and 3D IC development, and new technology ... at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades....of the most advanced technologies in the industry encompassing 3D and 2 . 5D interconnects.We are… more
- Apple Inc. (Santa Clara, CA)
- …and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2 . 5D , 3D , coreless MCM). Well versed with DOE principles ... reliability, testing, FA and package-system integration. Specialist in advanced packaging technologies (FOWLP/ 2 . 5D / 3D ): Knowledge and insight to deliver high… more
- Eridu Corporation (San Francisco, CA)
- …hands-on experience in advanced IC packaging and multi-die integration, including 2 . 5D / 3D CoWoS, bridge-based, or chiplet architectures. Proven track ... Responsibilities Own test vehicle definition and execution for advanced packaging technologies ( 2 . 5D CoWoS, 3D , bridge-based, high-density MCM) to drive… more
- Broadcom (San Jose, CA)
- …requires aspects of a successful layout engineer, an electrical background, a strong interest in 2 . 5D and 3D IC development, and new technology ... at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades....of the most advanced technologies in the industry encompassing 3D and 2 . 5D interconnects. We… more
- Cadence Design Systems, Inc. (San Jose, CA)
- …design capture, pre and post-layout simulation, optimization, layout, EM/IR analysis, thermal analysis, reliability, 2 . 5D and 3D IC , etc. We also ... optimisation, routage, analyses electromagnetiques/infrarouges, analyses thermiques, fiabilite, circuits integres 2 . 5D et 3D , etc. Nous collaborons… more
- Broadcom (San Jose, CA)
- …scale data centers . We are looking for experienced engineers to design cutting edge CoWos 2 . 5D , 3D interposer designs. You will be working on designing ... physical requirements of the interposers. Experience with interposer designs including CoWoS, 2 . 5D / 3D integration using Cadence Innovus/Integrity or Synopsys… more
- Cadence Design Systems, Inc. (San Jose, CA)
- …and finfet nodes, as well as 2D and 2 . 5D packaging as well as 3D IC stacking. PDK enablement task The PDK enablement team is a part of the Cadence ... et FinFET, ainsi que le packaging 2D et 2 . 5D et l'empilement de circuits integres 3D . Taches de l'equipe de deploiement et de developpement des PDK… more
- Broadcom (San Jose, CA)
- …and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2 . 5D interconnects. We are seeking an experienced SI/PI ... at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades....of new interconnect technologies and IP in the MCM, 2 . 5D , and 3D spaces, working… more
- Google (Sunnyvale, CA)
- …Device Physics). + Experience with advanced manufacturing nodes (eg, 5nm, 3nm) or assembly (eg, 2 . 5D , 3D , or Chiplet packaging). + Experience in a production ... in semiconductor reliability and manufacturing processes (fab, assembly, test), or IC and packaging failure mechanisms and related failure analysis. + Knowledge… more
