- Broadcom (San Jose, CA)
- …before you apply.** **Job Description:** Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs ... will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing… more
- Cisco Systems Inc (San Jose, CA)
- …highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D ... SiliconOne ASIC team is looking for an advanced IC package designer to help us develop our next generation...speed, and fabrication / assembly technology. You will drive package planning & layout to enable on-time, high-quality manufacturing… more
- Cisco (San Jose, CA)
- …highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D ... SiliconOne ASIC team is looking for an advanced IC package designer to help us develop our next generation...speed, and fabrication / assembly technology. You will drive package planning & layout to enable on-time, high-quality manufacturing… more
- Broadcom (San Jose, CA)
- …development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible ... for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/… more
- NVIDIA (Santa Clara, CA)
- …wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through ... their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed… more
- Qualcomm (San Diego, CA)
- …knowledge for wafer bump, assembly, substrate technology, material trends and flip-chip package designs and will be able to lead cross multiple disciplines to ... and define POR for QCOM's multi-chip module designs -Facilitate product package risk assessment, mitigation plans, and establishing best known processes methodology… more
- Cisco (San Jose, CA)
- …highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D ... on power, speed, and fabrication / assembly technology. You will drive ASIC package power and signal integrity rules and layout analysis to enable on-time,… more
- Insight Global (Hawthorne, CA)
- …Our Consumer Electronic client is looking for a Packaging Engineering Program Manager (Pkg EPM) to support the Product Experience (PX) team throughout the New Product ... Introduction (NPI) and Sustaining packaging development process. This includes schedule creation and coordination with inter-disciplinary teams to ensure packaging structure and artwork is developed and approved on-time. In addition to kicking off the NPI… more
- US Tech Solutions (South San Francisco, CA)
- …+ Client is looking for Technician who can work with a small team responsible for manufacturing custom shipping solutions, quality control of our current shipping ... solutions, and research and design support as needed for manufacturing and shipping to support a new project. **Responsibilities:** + Manufacture Custom Shipping Solutions. + Quality Control for our current packing and shipping protocols and SOPs. + Process… more
- The Boeing Company (El Segundo, CA)
- …thermal, and mechanical requirements. + Collaborate in multi-functional discussions for package architecture and technology roadmap (partner with Silicon IC team to ... design, materials, SI/PI, thermal, systems, and production teams to optimize package solutions on cost, performance, manufacturability, and reliability + Interface… more