- Micron Technology, Inc. (Boise, ID)
- …team that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for ... processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk...Engineering + Minimum of 5 years industry experience in Advanced Packaging As a world leader in… more
- Micron Technology, Inc. (Boise, ID)
- …Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be recognized as a domain expert in Fab Contamination ... the growth and innovation of the semiconductor industry. The Process Quality Engineering (PQE) team operates at the critical...Boise, ID, with a primary focus on fab and process contamination control. PQE defines priorities, conducts studies on… more
- Micron Technology, Inc. (Boise, ID)
- …to learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is ... leadership in the industry. **Position Overview:** We are seeking a Staff Design Engineer to join our TSV Packaging team. High-performance memory devices like… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily responsible for ... to learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's **Technology Development experts** develop data driven and physics based Advanced Modeling and AI solutions to tackle complex challenges in semiconductor ... component, packaging , and systems engineering. The team plays a key...storage portfolio. **Responsibilities** + Drive the deployment of intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor… more
- Micron Technology, Inc. (Boise, ID)
- …in Semiconductor Process Engineering + Solid engineering knowledge of semiconductor advanced packaging die stacking processes + Skilled at designing valid ... to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at...maintaining Micron's leadership in the industry. As a Principal Process Engineer in Die Bonding, you will… more
- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is ... maintaining Micron's leadership in the industry. The Thermal Simulation Engineer will be directly involved in developing new and...to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to… more
- Micron Technology, Inc. (Boise, ID)
- …team that is molding the future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you will be primarily responsible for ... for Micron products. You will grow into an expert engineer , driving roadmaps, which have a direct influence on...Defect analysis and data analysis. + Experience in semiconductor process engineering and packaging with fundamental understanding… more
- Micron Technology, Inc. (Boise, ID)
- …team that is molding the future of technology! **Position Overview:** As a Process Integration Engineer at Micron, you will define technology requirements, build ... program plans, and secure resources to drive process technology development programs. Your development focus will also...ensure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set… more
- Micron Technology, Inc. (Boise, ID)
- …you will play a key role in supporting the growth of our DRAM, HBM, and Advanced Packaging functions. **What You'll Do** As a Workforce Development Engineer , ... Three-plus years of experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on… more
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