- BAE Systems (Cedar Rapids, IA)
- …may be available based on position level and/or job specifics. ** Microelectronics Packaging Engineer - ( Hybrid )** **116436BR** EEO Career Site Equal ... independent work, it will take the form of a hybrid work format, with time split between working onsite...or Materials Engineering to join our team as a Microelectronics Packaging Design Engineer . As… more
- BAE Systems (Cedar Rapids, IA)
- …on position level and/or job specifics. **Senior Mechanical Engineer - Microelectronics Packaging ( Hybrid )** **114793BR** EEO Career Site Equal ... independent work, it will take the form of a hybrid work format, with time split between working onsite...and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers… more
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