• Sr Photonics Product Packaging Engineer

    Global Foundries (Malta, NY)
    …(APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration ( HI ) for AI, HPC, and data center applications. With a ... visit www.gf.com . Summary of Role: This hands-on packaging assembly integration role will deliver industry leading electro-optical transceiver s using GF… more
    Global Foundries (01/08/26)
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