- Qualcomm (San Diego, CA)
- …or equivalent. + 15+ years of hands-on experience in packaging technology development in 2 . 5D /3D for high density D2D interconnects, RDL, fanout ... visible role, you will be responsible for developing advanced 2 . 5D packaging technologies and defining...for high performance computing. Extensive knowledge and experience in 2 . 5D package technology development including… more
- Global Foundries (Malta, NY)
- …deliver industry leading electro-optical transceiver s using GF 's Photonix platform and advanced packaging 2 . 5D and 3D co-packaged optics form fact ors ... full-service semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...for 2D, 2 . 5D , 3D , 3. 5D SiPh advanced packaging . + Broad… more
- Global Foundries (Malta, NY)
- …deliver industry leading electro-optical transceiver s using GF 's Photonix platform and advanced packaging 2 . 5D and 3D co-packaged optic form fact ors ... full-service semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...for 2D, 2 . 5D , 3D , 3. 5D SiPh advanced packaging . + Broad… more
- Global Foundries (Malta, NY)
- …deliver industry leading electro-optical transceiver s using GF 's Photonix platform and advanced packaging 2 . 5D and 3D co-packaged optics form fact ors ... full-service semiconductor foundry providing a unique combination of design, development , and fabrication services to some of the world's...for 2D, 2 . 5D , 3D , 3. 5D SiPh advanced packaging . + Broad… more
- Global Foundries (Malta, NY)
- …data centers, automotive and communications + Expert in chip package interaction for 2D, 2 . 5D , 3D SiPh advanced packaging Preferred Qualifications: + A ... platform growth into world class fully packaged electro -optical transceiver offerings utilizing 2 . 5D and 3D co-packaged optics form factors. The candidate will… more
- Global Foundries (Malta, NY)
- …GLOBALFOUNDRIES is seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced Silicon Photonics optical ... as it strives to offer heterogeneous solutions utilizing light-in/out with 2D, 2 . 5D and 3D solutions. Essential Responsibilities : + Silicon photonics… more
- SpaceX (Bastrop, TX)
- …Advanced technical degree + 15+ years industry experience with microelectronics packaging development + Familiarity with 2D, 2 . 5D , and/or 3D packaging ... next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and...integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for hands-on and… more
- Google (Sunnyvale, CA)
- … materials, and reliability requirements (component and board level). + Knowledge in 2 . 5D and 3D packaging technologies for high performance computing. ... practical experience. + 10 years of experience with package development for high volume production. + 3 years of...Experience in the thermal and mechanical modeling of silicon packaging . + Experience with the qualification process for advanced… more
- Global Foundries (Malta, NY)
- …deliver industry leading electro-optical transceiver s using GF 's Photonix platform and advanced packaging 2 . 5D and 3D co-packaged optics form fact ors ... ctures that will be a focus of activities. Influence packaging technology development direction to ensure readiness...for 2D, 2 . 5D , 3D , 3. 5D SiPh advanced packaging . + Broad… more
- Northrop Grumman (Apopka, FL)
- …technology development ._ _The Apopka, Florida, wafer bumping u-Line supports flip chip, 2 . 5D , and 3D packaging for internal and external production ... that include photo, sputter, electro-plating, AOI, and solder-sphere transfer to support flip chip, 2 . 5D , and 3D packaging using 100 mm to 300mm wafers.… more