• 3D Advanced Heterogeneous

    Global Foundries (Malta, NY)
    …to network with executives. Summary of Role: Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes ... verbal communication skills + Strong planning & organizational skills + Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus… more
    Global Foundries (08/09/25)
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  • Integration Engineer - Factory

    Insight Global (Austin, TX)
    … Engineer will focus on processing of test and demonstration vehicles in advanced Heterogeneous Integration projects. This role will initially involve ... Develop successful shortloop and full integrated processes to demonstrate various heterogeneous integration prototypes. Significant hands-on role within the… more
    Insight Global (09/09/25)
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  • 3D Heterogeneous Integration

    Global Foundries (Malta, NY)
    …state-of-the-art 300mm fabrication facility in Malta, New York . This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our ... etc.) that must be followed for an integrated circuit (IC) design to be manufacturable. + Advanced packaging liaison to the DM and PDK ( Process D esign K it) teams… more
    Global Foundries (07/23/25)
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  • Member of Technical Staff (MTS) - Advanced

    Global Foundries (Malta, NY)
    …continuing to develop solutions for differentiated technology. Enabling Silicon Photonics advanced packaging as it strives to offer heterogeneous solutions ... www.gf.com. Summary of Role: GLOBALFOUNDRIES is seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced more
    Global Foundries (09/01/25)
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  • Package Design Engineer

    Meta (Menlo Park, CA)
    …Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve bandwidth, power ... or equivalent practical experience 14. Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D ...and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to… more
    Meta (08/01/25)
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  • Principal SOC Pre-Silicon Verification Engineer-…

    Micron Technology, Inc. (Richardson, TX)
    …of SoC Verification, testbench architecture, SoC verification methodologies, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose ... world to learn, communicate and advance faster than ever. **Job Description:** The ** Heterogeneous Integrating Group (HIG** ) is a division within the Technology and… more
    Micron Technology, Inc. (07/01/25)
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