• 3D Heterogeneous Integration…

    Global Foundries (Malta, NY)
    …facility in Malta, New York . This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our next-generation advanced ... is a leading full-service semiconductor foundry providing a unique combination of design , development, and fabrication services to some of the world's most inspired… more
    Global Foundries (07/23/25)
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  • 3D Advanced Heterogeneous…

    Global Foundries (Malta, NY)
    …network with executives. Summary of Role: Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes wafer ... is a leading full-service semiconductor foundry providing a unique combination of design , development, and fabrication services to some of the world's most inspired… more
    Global Foundries (08/09/25)
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  • Integration Engineer - Factory

    Insight Global (Austin, TX)
    …will focus on processing of test and demonstration vehicles in advanced Heterogeneous Integration projects. This role will initially involve toolset ... Develop successful shortloop and full integrated processes to demonstrate various heterogeneous integration prototypes. Significant hands-on role within the… more
    Insight Global (09/09/25)
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  • Package Design Engineer

    Meta (Menlo Park, CA)
    … design analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve bandwidth, power efficiency ... design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer packaging. This includes: design ...and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to… more
    Meta (08/01/25)
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  • Principal SOC Pre-Silicon Verification Engineer-…

    Micron Technology, Inc. (Richardson, TX)
    …of SoC Verification, testbench architecture, SoC verification methodologies, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose ... world to learn, communicate and advance faster than ever. **Job Description:** The ** Heterogeneous Integrating Group (HIG** ) is a division within the Technology and… more
    Micron Technology, Inc. (07/01/25)
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  • Assistant Professor - Microelectronics

    Auburn University (Auburn, AL)
    …background in analog / RF electronics, integrated circuit design , 2.5D / 3D packaging or heterogeneous integration . The individual selected for this ... analog / RF electronics, integrated circuit design , 2.5D / 3D packaging or heterogeneous integration . We particularly seek candidates who are eligible to… more
    Auburn University (08/30/25)
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  • Product Pathfinding Engineer- HIG-TPG

    Micron Technology, Inc. (Boise, ID)
    …mission to be the most efficient producer of DRAM memory. In HIG ( Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end ... be responsible for the implementation of innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging...and backend processes with groundbreaking design , debugging various tests, and qualification techniques to develop… more
    Micron Technology, Inc. (07/31/25)
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  • Member of Technical Staff (MTS) - Advanced Silicon…

    Global Foundries (Malta, NY)
    … heterogeneous solutions utilizing light-in/out with 2D, 2.5D and 3D solutions. Essential Responsibilities : + Silicon photonics detachable light-in/out solution ... SiPh lab assembly tool operation and process development + Collaborating with design , integration , & packaging team in driving light-in / out solutions. +… more
    Global Foundries (09/01/25)
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