• Advanced Packaging Process

    Micron Technology, Inc. (Boise, ID)
    …team that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for ... processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk...Engineering + Minimum of 5 years industry experience in Advanced Packaging As a world leader in… more
    Micron Technology, Inc. (06/25/25)
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  • Member of Technical Staff (MTS) - Advanced

    Global Foundries (Malta, NY)
    …Summary of Role: GLOBALFOUNDRIES is seeking a MTS engineer for its Advanced Silicon Photonics Packaging Technology Development team. In our advanced ... will demonstrate a strong understanding of Silicon Photonics and advanced packaging technology, with a proven expertise...process development + Collaborating with design, integration, & packaging team in driving light-in / out solutions. +… more
    Global Foundries (06/03/25)
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  • Advanced Lead - SiC/GaN Power Module…

    GE Aerospace (Pompano Beach, FL)
    …have to offer. A GaN (Gallium Nitride) and SiC (Silicon Carbide) Power Module Packaging Engineer focuses on the design of power modules along with development, ... high power density power electronics. **Job Description** The Power Module Packaging Engineer is responsible for developing, optimizing, and implementing… more
    GE Aerospace (04/25/25)
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  • Advanced Packaging Disruptive…

    Applied Materials (Austin, TX)
    …and journals. **Functional Knowledge** + Regarded as the technical expert in Wafer Advanced Packaging Technology + Demonstrates in-depth expertise in Wafer ... 2.5 and 3D package architectures. **Key Responsibilities** + On-site Process Integration for novel wafer level assembly flows including...Advanced Packaging Technology and broad knowledge of … more
    Applied Materials (07/09/25)
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  • Electrical Engineer - Microelectronics…

    L3Harris (Palm Bay, FL)
    …and cyber domains in the interest of national security. Job Title: Senior Specialist, Advanced Packaging Integration Job Code: 23736 Job Location: Palm Bay, FL ... This position is responsible for the development and execution of advanced packaging assembly processes including hybrid and thermocompression bonding… more
    L3Harris (05/07/25)
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  • Staff Equipment Development Engineer

    Micron Technology, Inc. (Boise, ID)
    …the future of technology! **Position Overview:** As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) ... lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes.… more
    Micron Technology, Inc. (07/21/25)
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  • Lead, Semiconductor & Advanced

    L3Harris (Palm Bay, FL)
    …cyber domains in the interest of national security. Job Title: Lead, Semiconductor & Advanced Packaging Facilities Engineer Job Code: 25333 Job Location: ... Palm Bay, FL Job Schedule: 9/80 Job Description: The Lead, Semiconductor & Advanced Packaging Facilities Engineering position is an on-site role based in Brevard… more
    L3Harris (07/04/25)
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  • Equipment Engineer - Advanced

    Micron Technology, Inc. (Boise, ID)
    …is molding the future of technology! **Position Overview:** As an Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) ... improvement and cost reduction activities. This role requires collaboration with process development, manufacturing, and equipment vendors to ensure robust processes… more
    Micron Technology, Inc. (07/04/25)
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  • Packaging Engineer III or Sr. (Days…

    LSI Solutions (Victor, NY)
    …root cause investigations. + Supports Design and Process FMEAs to develop robust packaging systems and processes. Packaging Engineer III + All essential ... all, our customer is ultimately the patient. POSITION TITLE: Packaging Engineer III or Sr. SHIFT HOURS:...ESSENTIAL FUNCTIONS: + Reviews product engineering change orders and packaging process changes, including labels specifications, and… more
    LSI Solutions (06/14/25)
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  • Advanced Packaging Research…

    IBM (Albany, NY)
    … technology, 2) More than 5 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and ... reliability testing, and failure analysis, 2) Basic understanding of wafer level packaging /assembly processes, laminate, reliability test, and tools , 3) Ability to… more
    IBM (06/27/25)
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