- Neotech (Chatsworth, CA)
- …in order to fine tune machine programs. + Written tests for ESD + Manual Die attach and Auto die attach requirements. + Use tools such as ... Place equipment or equivalent. + Minimum 1 year working experience as a manual die attach /sub- attach operator in a microelectronic assembly factory. +… more
- Neotech (Chatsworth, CA)
- …bond strengths. + Inspect and know the difference between an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon ... Summary: Operation of automatic and/or manual wire bond equipment in a clean-room environment,...materials and surroundings. + Ability to operate Plasma Cleaners, Auto wirebond, Ribbon bond and Bond Pull machines used… more
- BAE Systems (Nashua, NH)
- … (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach . Must be familiar with lamination presses, bladder bag ovens ... such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI...IC's, caps, diodes and resistors, soldering skills and eutectic die attach . Must be familiar with lamination… more
- Teledyne (Mountain View, CA)
- …of tweezers, microscopes to place small components on thin-film circuits. + Performs eutectic attach and epoxy attach under microscope + Operating all type of ... MIC equipment, such as die -attached station, wedge bonder, ball bonder, gap welder, bond-pull...or be-trained with automation, such as reflow brazing system, auto wedge-ball bonder + May perform other assembly tasks,… more