• Chiplet Process Integration

    IBM (Albany, NY)
    …growth and innovation thrive. **Your role and responsibilities** IBM Research is seeking a Chiplet Process Integration Engineer to join our world-class ... semiconductor integration solutions. Key Responsibilities * Drive wafer-level process integration for advanced chiplet and 3D bonding technologies. *… more
    IBM (04/29/25)
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  • Principal IC Packaging Engineer , Silicon…

    SpaceX (Bastrop, TX)
    …system-in-package SiP, multi-chip modules MCM, wirebond, panel level packaging, heterogenous and chiplet integration + Hands-on packaging, PCBA, and SMT assembly ... Principal IC Packaging Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX...fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house… more
    SpaceX (04/15/25)
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  • Sr. IC Packaging Engineer , Silicon…

    SpaceX (Bastrop, TX)
    …processes, system-in-package SiP, multi-chip modules MCM, panel level packaging, heterogenous and chiplet integration + Hands-on packaging, PCB, PCBA, or SMT ... Sr. IC Packaging Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX...fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house… more
    SpaceX (04/15/25)
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  • ASIC Engineer , Networking Architecture

    Meta (Austin, TX)
    …aspects - Ethernet or RDMA 13. Complete knowledge of ASIC development on advanced process nodes using chiplet based solutions 14. Experience working with MPI, ... **Summary:** As an Networking ASIC Engineer on the Infrastructure silicon team at Meta,...with design implementation 5. Define ASIC networking roadmap for integration in future generations of infrastructure AI accelerators working… more
    Meta (02/01/25)
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  • DFT Engineer (Server)

    Qualcomm (San Diego, CA)
    …cost, increase product quality, and enhance yield learning on leading edge process technologies. The candidate should have solid hands-on experience with industry ... + Experience working on DFT for datacenter and/or 2.5D/3D chiplet products is strongly recommended + 8+ years industry...field and 6+ years of ASIC design, verification, validation, integration , or related work experience. OR Master's degree in… more
    Qualcomm (04/08/25)
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