- Micron Technology, Inc. (Boise, ID)
- …the future of technology!** **Position Overview:** As an Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) ... team, you will develop and optimize next-generation SAOK wafer and die equipment to enhance capability, efficiency, and cost. You will take ideas from conception… more
- Micron Technology, Inc. (Boise, ID)
- …future of technology! **Position Overview:** As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, ... will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment . You will take ideas from conception through development to implementation… more
- Northrop Grumman (Apopka, FL)
- …_Northrop Grumman Mission Systems is seeking a_ **_Sr Principal Microelectronic Semiconductors Equipment Engineer_** _for our Advanced Packaging Technology ... and solder-sphere transfer to support flip chips, 2.5D, and 3D packaging ._ _The Semiconductor Equipment Engineer will lead and manage engineering projects… more
- GE Aerospace (Pompano Beach, FL)
- …have to offer. A GaN (Gallium Nitride) and SiC (Silicon Carbide) Power Module Packaging Engineer focuses on the design of power modules along with development, ... high power density power electronics. **Job Description** The Power Module Packaging Engineer is responsible for developing, optimizing, and implementing… more
- Insight Global (Austin, TX)
- …to ensure we are driving fast cycles of learning in semiconductor advanced packaging . Each equipment engineer will be responsible for one of these ... Job Description Insight Global is looking for a Equipment Engineer to work on site... engineering experience in a semiconductor fab or semiconductor advanced packaging facility. Equipment Installation… more
- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. As an Advanced Packaging Engineer you will be primarily responsible for starting ... methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process… more
- Micron Technology, Inc. (Boise, ID)
- …level bonding, or MS degree + 5(+) years of industry experience specific to Advanced Packaging and wafer-to-wafer bonding. As a world leader in the semiconductor ... faster than ever. Responsibilities will include: * Develop, diagnose and resolve packaging process related problems for Die and Wafer bonding related projects *… more
- SpaceX (Bastrop, TX)
- …for hands-on and dynamic engineers with expertise in advanced semiconductor packaging assembly design, development, equipment , and testing. You will assume ... Principal IC Packaging Engineer , Silicon Technology (Starlink) Bastrop,...design, materials, thermal, systems, and production teams + Implement advanced packaging solutions into SpaceX next generation… more
- Micron Technology, Inc. (Boise, ID)
- …faster than ever. Welcome! We at Micron are seeking a skilled and ambitious **Shift Process Engineer ** to join us in Boise, ID. As an APTD Process Engineer , you ... all areas and work functions. This includes partnering with suppliers, equipment owners and shift engineers/technicians to complete daily activities and… more
- SpaceX (Bastrop, TX)
- Sr. IC Packaging Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out exploring the ... goal of enabling human life on Mars. SR. IC PACKAGING ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is...design, materials, thermal, systems, and production teams + Implement advanced packaging solutions into SpaceX next generation… more