• IC Packaging Principal…

    Cadence Design Systems, Inc. (San Jose, CA)
    …IC Package Routing, Technologies, and Flows. Location San Jose, CA, on-site. As an IC Packaging Product Engineer, you will be responsible for driving ... looking for a candidate to be part of its Product Engineering Team in the System Design and Analysis...innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions… more
    Cadence Design Systems, Inc. (07/18/25)
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  • Principal IC Packaging…

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer,...(NTI) for assembly packaging lines + Own packaging prototypes, product development, and release to ... this possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its… more
    SpaceX (07/15/25)
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  • Principal IC Packaging Test…

    SpaceX (Bastrop, TX)
    Principal IC Packaging Test Engineer, Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER,...+ Define full and comprehensive testing requirements to ensure product conformance + Schematic and electrical review for all… more
    SpaceX (07/15/25)
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  • Principal Design Engineer, TSV…

    Micron Technology, Inc. (Boise, ID)
    …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
    Micron Technology, Inc. (08/09/25)
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  • Principal Engineer, Packaging…

    SanDisk (Milpitas, CA)
    …through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in thermal ... work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and… more
    SanDisk (09/05/25)
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  • Principal Reliability/FA Engineer

    Skyworks (Newbury Park, CA)
    …BS degree in Electrical Engineering with at least 12 years of experience in packaging , assembly of semiconductor IC -s and supervision of activities related to ... Principal Reliability/FA Engineer Apply now " Date:Aug 24,...broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone… more
    Skyworks (07/08/25)
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  • Principal RFIC Design Engineer

    SpaceX (Hawthorne, CA)
    Principal RFIC Design Engineer Hawthorne, CA Apply SpaceX... IC floor planning and layout + Own packaging prototypes, product development, and release to ... possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL RFIC DESIGN ENGINEER (STARSHIELD) Starshield leverages SpaceX's Starlink technology and… more
    SpaceX (08/26/25)
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  • Senior Principal MMIC Design Engineer

    Mercury Systems (Peachtree Corners, GA)
    …and defense applications, advancing innovation where it matters most. The senior principal mmic design engineer will be responsible for designing and testing RF ... Uses CAD tools to design printed circuit boards and packaging for evals and modules + Work with semiconductor...+ Drive technical innovation by improving processes, promoting new product ideas, and solving technical challenges + Guide and… more
    Mercury Systems (06/21/25)
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