- Arm Limited (San Jose, CA)
- …Required Skills and Experience: An Electrical Engineering degree or equivalent Experience with 2 . 5D and 3D package systems and their SI/PI requirements ... Arm Principal Package Layout Engineer Arm has a great...Compute spaces. These complex designs use current and emerging 2 .5 and 3D technologies and will require… more
- Arm Limited (San Diego, CA)
- …in high performance design, implementation and timing convergence is a plus Experience with 2 . 5D and 3D test Experience with Cadence, and/or Synopsys DFT ... characterization and validation. Required Skills and Experience : This role is for a Principal DFT Engineer / DFT STA Constraints Lead with 10+ years of experience… more
- RTX Corporation (Andover, MA)
- …with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D , and 2 . 5D (interposer + chiplets) and novel ... processing and finishing (plating, bumping, dicing) + Design experience with 3D and 2 . 5D packaging, complex CAD/EDA software design workflows, and… more
- Northrop Grumman (Shelbyville, TN)
- …for MMIC product development. + MMIC design using linear and nonlinear models and 2 . 5D and 3D electromagnetic simulators. + Develop Power Amplifier (PA), ... only part of history, they're making history. **Position Description** The ** Principal /Senior Principal MMIC Design Engineer** position supports Northrop… more
- Northrop Grumman (Apopka, FL)
- …cleanliness using SEM, FTIR, ellipsometry, contact angle, and XPS_ + _Experience in flip-chip, 2 . 5D , and 3D packaging_ + _Active Secret Clearance or Higher_ ... and MES data, and other in-process metrics_ **_Basic Qualifications for Principal Microelectronics/Semiconductor Metals Process Engineer_** **_:_** + _BS Degree in… more
- Henkel (Irvine, CA)
- …and molding technologies. + Solid understanding of current and emerging packaging trends, including 2 . 5D and 3D packaging. + Proven ability to work ... Principal Application Engineer - Semiconductor Advanced Package **_About_** **_this_** **_position_** At Henkel, you'll be part of an organization that's shaping the… more
- Northrop Grumman (Apopka, FL)
- …technology development. The Apopka, Florida, wafer bumping u-line will support flip-chip, 2 . 5D , and 3D packaging for internal production customers, ... as well as emerging technology programs. The line provides a range of wafer post-processing capabilities._ **_What You'll get to Do:_** + _The Microelectronics Operations Project Manager serves as the manufacturing team liaison to/from program management,… more
- Micron Technology, Inc. (Boise, ID)
- …spot issues. The scope of your work will be to address all Thermal aspects of 2 . 5D and 3D advanced packaging development that are related to design, material ... and process interactions. In this position you will collaborate with package architecture and design, fab/package assembly process integration, BU teams, and customers. We are looking for a passionate, hard-working, and self-motivated individual with the… more
- Broadcom (San Jose, CA)
- …advanced silicon and packaging process technologies, including 2D, 2 . 5D , and 2 . 5D with 3D memories. + Precision Scopes, Analyzers, development & ... for a job. (Click Sign In > Create Account)** ** 2 . If you already have a Candidate Account, please...please Sign-In before you apply.** **Job Description:** As a Principal Hardware Engineer, you will design, develop, and deliver… more
