- Micron Technology, Inc. (Boise, ID)
- …GDDR packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical requirements of the future. Finite element ... analysis of package design enables innovation and development of outstanding solutions to...simulation. + Collaborate daily with global teams in product design , engineering, technology, and business units to analyze manufacturing… more
- Micron Technology, Inc. (Richardson, TX)
- …are developing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using TSV (Through Silicon Via), we stack multiple DRAM chips on a high-speed memory ... be part of a multi-functional team of experts in Design Engineering, Product Engineering, Process Development, Package Engineering &...are most challenging due to the size of the design and complexity of the functions. They require significant… more