- Micron Technology, Inc. (Boise, ID)
- …Micron's leadership in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance ... GDDR packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical requirements of the future. Finite element… more
- Micron Technology, Inc. (Boise, ID)
- …Micron's leadership in the industry. **Position Overview:** The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced ... the Product power maps, die and package architecture, and Si BEOL design rules, finding efficient package structure and materials to mitigate any potential… more