• Principal IC Packaging

    SpaceX (Bastrop, TX)
    Principal IC Packaging Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is out ... this possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging… more
    SpaceX (07/15/25)
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  • Principal IC Packaging Test…

    SpaceX (Bastrop, TX)
    Principal IC Packaging Test Engineer , Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its experience… more
    SpaceX (07/15/25)
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  • IC Packaging Principal

    Cadence Design Systems, Inc. (San Jose, CA)
    IC Package Routing, Technologies, and Flows. Location San Jose, CA, on-site. As an IC Packaging Product Engineer , you will be responsible for driving ... innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions...substrate interconnect challenges of advanced package designs. The Product Engineer bridges the gap between customers and R&D, ensuring… more
    Cadence Design Systems, Inc. (07/18/25)
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  • Principal Engineer

    SanDisk (Milpitas, CA)
    …keep our world moving forward. **Job Description** ESSENTIAL DUTIES AND RESPONSIBILITIES: + As a Packaging Engineer , you will work in the Packaging R&D group ... academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas. + A strong background in thermal sciences with… more
    SanDisk (09/05/25)
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  • Principal Design Engineer , TSV…

    Micron Technology, Inc. (Boise, ID)
    …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
    Micron Technology, Inc. (08/09/25)
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  • Principal Reliability/FA Engineer

    Skyworks (Newbury Park, CA)
    Principal Reliability/FA Engineer Apply now " Date:Aug 24, 2025 Location: Newbury Park, CA, US Company: Skyworks If you are looking for a challenging and ... BS degree in Electrical Engineering with at least 12 years of experience in packaging , assembly of semiconductor IC -s and supervision of activities related to… more
    Skyworks (07/08/25)
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  • Principal RFIC Design Engineer

    SpaceX (Hawthorne, CA)
    Principal RFIC Design Engineer Hawthorne, CA Apply SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally ... the ultimate goal of enabling human life on Mars. PRINCIPAL RFIC DESIGN ENGINEER (STARSHIELD) Starshield leverages...partition functions between hardware and software domains + Perform IC floor planning and layout + Own packaging more
    SpaceX (08/26/25)
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  • Senior Principal MMIC Design…

    Mercury Systems (Peachtree Corners, GA)
    …aerospace and defense applications, advancing innovation where it matters most. The senior principal mmic design engineer will be responsible for designing and ... that operate from HF through Ka band. The ideal engineer has significant design experience with both GaAs and...Uses CAD tools to design printed circuit boards and packaging for evals and modules + Work with semiconductor… more
    Mercury Systems (06/21/25)
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